SMT, PCB Electronics Industry News

Pan Pacific Microelectronics Symposium Program Finalized

Dec 06, 2017

SMTA announced that the program is finalized for the 23rd Annual Pan Pacific Microelectronics Symposium. The event will take place February 5-8, 2018 at the Hapuna Beach Prince Resort on the Big Island of Hawaii. The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.

The technical sessions, with over 50 presentations, will include Automotive Systems and Hardware, Materials and Reliability, Inspection and Test Techniques, Cleaning Technologies, Advanced Materials, Interposer and Packaging Technology, Advanced Processes and Packaging, Nontechnology Applications, Advanced Packaging and Processes, Advanced Process, Heterogeneous Integration.

On the afternoon of Monday, February 5, a plenary keynote session will kick off the event featuring presentations on Defense Electronics; The Latest Material Technologies for Systems in Package; Management of Complexity in Research and Development Work; and Selected Highlights From the 2017 iNEMI Roadmap and Key Projects to Address Identified Gaps.

On Tuesday, February 6, Yoshiaki Sakagami, Honda, will deliver the keynote lunch talk on “Honda’s New Mobility System Development Challenge; Key Functions and Devices for Intelligent Mobility System.” On Wednesday, February 7, Dwight Howard, Delphi Automotive, LLC, will deliver the lunch keynote on “Integrated Intelligent Transportation and Key Enablers.” Dongkai Shangguan, Ph.D., Flex, will deliver the final keynote lunch presentation about “Cost Effective Solutions for SiP and Miniaturized Modules” on Thursday, February 8.

View the complete program and register at the website: https://www.smta.org/panpac. Please contact Tanya Martin, tanya@smta.org or 952-920-7682, with questions about the program. Promotional packages are available for companies wishing to have exposure for their products and services. Contact Karlie Severinson, karlie@smta.org, for details.


The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Feb 19, 2018 -

SMTA Capital Chapter to Host Chapter Tutorial Program

Feb 08, 2018 -

SMTA Announces 2018 Certification Program Offerings

Feb 07, 2018 -

Phil Zarrow, ITM Consulting, to Present at SMTA Capital Chapter Tutorial Program

Feb 06, 2018 -

Electronics in Harsh Environments Conference Program Finalized

Feb 02, 2018 -

IWLPC Technical Committee Announces Best Presentation & Papers Awards for 2017

Feb 02, 2018 -

SMTA “Members of Distinction” Award Winners Announced

Feb 01, 2018 -

SMTA International, Sensors Midwest to Co-locate

Jan 31, 2018 -

SMTA Capital Chapter to Host Chapter Tutorial Program on March 15th

Jan 28, 2018 -

SMTA “Members of Distinction” Award Winners Announced

Jan 15, 2018 -

SMTA International 2017 Best Papers Announced

579 more news from Surface Mount Technology Association (SMTA) »

Feb 20, 2018 -

Expanding Sales Growth sees New Directors Appointed at Europlacer Americas

Feb 20, 2018 -

ZESTRON to Demonstrate VIGON® RC 303 at IPC APEX 2018

Feb 19, 2018 -

Horizon Sales Heads to San Diego for APEX!

Feb 19, 2018 -

Cogiscan Is Growing: New Regional Sales Manager for the Americas

Feb 19, 2018 -

CyberOptics Demonstrates Advanced Airborne Particle Sensing Technology Recognized as Best Known Method (BKM) at SEMICON China

Feb 19, 2018 -

Award-Winning Reflow, Selective Solder & Rework from Ersa at SMTA Intermountain Expo

Feb 19, 2018 -

SMTA Capital Chapter to Host Chapter Tutorial Program

Feb 19, 2018 -

IPC Releases New IPC/PERM-2901, Pb-free Design and Assembly Implementation Guide IPC-PERM-2901 addresses the impact of Pb-free on reliability and service life for aerospace, defense and high-performa

Feb 19, 2018 -

Nordson YESTECH Installs BX Benchtop AOI System at Fluid Components International

Feb 19, 2018 -

BTU to Demo TrueFlat Technology for Substrate Flatness at SEMICON China

See electronics manufacturing industry news »

Pan Pacific Microelectronics Symposium Program Finalized news release has been viewed 436 times

SMT Spare Parts and Feeders

Non-heated dispensing system