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  • Nordson MARCH Will be Ready to Discuss Plasma Technologies at Productronica 2017

Nordson MARCH Will be Ready to Discuss Plasma Technologies at Productronica 2017

Nov 08, 2017

Nordson MARCH will be ready to discuss plasma technologies for printed circuit board, microelectronics, and semiconductor packaging in stand A2.345/445 at Productronica 2017

Nordson MARCH, a Nordson company (NASDAQ:NDSN), a global leader in plasma processing technology, will be ready to discuss plasma technologies for printed circuit board, microelectronics, and semiconductor packaging in stand A2.345/445 at Productronica, the world’s leading trade fair for electronics development and production, to be held in Munich, Germany, November 14-17, 2017.

Nordson MARCH’s VIA systems for the plasma treatment of printed circuit boards are the benchmark for panel and roll-to-roll processing. The SPHERE systems for wafer processing are designed to handle all wafer sizes up to 450mm including 300mm wafers on wafer frames, making Nordson MARCH the natural partner for plasma systems for wafer level packaging.

For more information, contact Nordson MARCH at info@nordsonmarch.com.

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Nordson MARCH Receives NPI Award for its RollVIA Self-contained Vacuum Plasma System

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Nordson MARCH MesoSPHERE Plasma Systems Enable Very High Throughput Processing for 3D and Wafer-level Package Assembly

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Nordson MARCH Introduces the new-generation RollVIA plasma system for roll-to-roll production in PCB manufacturing operations Completely Self-Contained with Integrated Pump Package

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Nordson MARCH Presents Paper at SMTA Guadalajara on Enhancing Performance of PCBAs Using Plasma Treatment

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Revolutionary AOI, AXI and & Bondtesting from Nordson at NEPCON South China

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Nordson MARCH Wins 2017 New Product Introduction Award for its ModVIA Plasma System

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Nordson MARCH's New Plasma Polymerization Deposition Systems Deposit Materials During Precision Manufacturing Processes

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Nordson MARCH Receives Global Technology Award for FlexTRAK-CDS High-volume Plasma System

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Nordson MARCH's Plasma Confinement Ring Increases Etch Rate and Improves Treatment Uniformity for Wafer Processing

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