SMT, PCB Electronics Industry News

Samsung Volume Production In 300mm Wafer Fab

Oct 30, 2001

Hoping to extend its lead in DRAMs and other chip products, South Korea's Samsung Electronics Co. Ltd. here today announced that it has begun mass production in its initial 300-mm wafer fab.

The Korean memory giant has begun producing 512-megabit, double-data-rate (DDR) SDRAMs in the 300-mm, 0.12-micron fab, which is located in the Hwasung Industrial complex here, according to Samsung, the world's largest DRAM maker.

The move towards 300-mm production is aimed to boost the company's competitiveness and leadership in the memory markets. In general, a 300-mm wafer line has 2.5 times the capacity of an 8-inch (200-mm) plant, paving the way for lower production costs.

It is also designed to propel Samsung into the world's second largest chip maker by 2005, with worldwide sales of $20 billion, said Chang-Gyu Hwang, president of Samsung's Memory Division.

"Our semiconductor operations will achieve annual sales of $20 billion in 2005 by diversifying our memory product portfolio and maximizing our competitiveness," Hwang said. "We are nowapplying 300-mm wafers to our memory chip mass production and have begun mass-producing 512-megabit DRAMs to upgrade our lineup and satisfy demand for higher-capacity memory products," he said.

In July, Samsung started up the test operations within the 300-mm wafer line, and by September, the first commercial products were coming off the line, according to the company.

By 2003, Samsung will move its 300-mm fabs to the 100-nm (0.10-micron) node. It will produce 512-Mbit DRAMs and other products.


Samsung Electronics Co., Ltd., with 1999 sales revenue of US$22.8 billion is a world leader in the electronics industry. Headquartered in Korea, the company has operations in about 50 countries with 54,000 employees worldwide. The company consists of three main business units: Digital Media, Semiconductors and Information & Communications Businesses.

Mar 12, 2002 -

Samsung Files Patent Infringement Suit Against SanDisk

Mar 07, 2002 -

Samsung Reorganizes Semiconductor Group

Nov 28, 2001 -

Samsung Calls Infineon Charges 'nonsense'

Aug 21, 2001 -

Korea's Samsung Electronics Boosts Marketing Budget

Aug 10, 2001 -

SAMSUNG Develops Low-Power 8Mb SRAM/64Mb NAND Flash Stacked MCP Memory Device

Jul 20, 2001 -

Samsung Sees DRAM Supply-Demand Imbalance Until Q4

Jul 16, 2001 -

SAMSUNG Licenses ARM Microprocessor Cores - Agreement Enables Samsung To Target 800 MHz Standard Products

Apr 05, 2001 -

Samsung Electronics Gets Behind QDR Standard

Mar 29, 2001 -

Korea's Samsung Elec To Cut 2001 Chip Capex-Report

Mar 27, 2024 -

Red Glue SMT Solutions: A Cost-Effective Approach for Double-Sided PCBs

Mar 26, 2024 -

North American PCB Industry Sales Down 11.6 Percent in February

Mar 26, 2024 -

iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs

Mar 26, 2024 -

Don Dennison Appointed to Roll Out KIC's Latest Thermal Analysis System Software in the Northeast

Mar 26, 2024 -

Altus Group Achieves Record Sales Milestone with Koh Young Europe

Mar 26, 2024 -

STI Welcomes Edrick Young as the Newest Mechanical Assembly Technician

Mar 26, 2024 -

Anda Technologies Receives 2024 NPI Award for Setting a New Standard in Smart Manufacturing

Mar 26, 2024 -

ZESTRON's Olaf Schoenfeld, Ph.D. to Participate in EV Special Session at IPC APEX Expo

Mar 26, 2024 -

North American EMS Industry Up 4.1 Percent in February

Mar 26, 2024 -

SMTA Europe Announces 2024 Spring Conferences

See electronics manufacturing industry news »

Samsung Volume Production In 300mm Wafer Fab news release has been viewed 931 times

Solder Paste Dispensing

Reflow Oven