Aug 03, 2017 
Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Stand 1H20 at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center. Test and inspection solutions from Nordson DAGE, Nordson MATRIX and Nordson YESTECH will be demonstrated at the event.
The Nordson DAGE Quadra™ 5, with industry-leading core technology, offers high performance and ease of use for 2D and 3D X-ray applications. 0.35μm feature recognition up to 10 W of power, makes the Quadra™ 5 the leading choice for printed circuit board and semiconductor package inspection.
Nordson DAGE also will highlight its award-winning 4000Plus Bondtester with Camera Assist Automation, ideally suited for pull-and-shear testing of wafer interconnections, lead frames, hybrid microcircuits or automotive electronic packages.
Nordson MATRIX presents an excellent inline solution with its X#-series systems. This modular automated inspection platform is designed for flexible, high-speed inline X-ray inspection. The platform features up to 4 advanced technologies in one system: Transmission X-ray imaging (2D) with patented Slice-Filter- Technique™ (SFT), Off-Axis technology (2.5D) and 3D SART. The exhibited X2.5# system allows high-speed off-axis image acquisition from different angles and presents a reliable solution for the inline inspection not only of double-sided PCB assemblies but a wide range of various applications (e.g. SMT, Power Hybrid inspection, battery inspection).
Nordson YESTECH’s FX-940UV makes inspection of conformal coatings simple and convenient by automating the inspection process. The system inspects for quality and consistency of coating coverage under proprietary ultra violet lighting with the use of proprietary inspection algorithms. An optional coating thickness measurement package also is available.
Nordson DAGE, MATRIX and YESTECH, units of Nordson Corporation (NASDAQ: NDSN), manufacture and support a complete range of industry leading Test and Inspection products for the electronics industry. Offering an award winning portfolio of Automated Optical Inspection (AOI), Automated X-ray Inspection (AXI), Manual X-ray Inspection (MXI), Bond Testing, Micro Materials Testing and Wafer X-ray Metrology systems, Nordson’s family of Test and Inspection products bring powerful and cost effective solutions to the Printed Circuit Board Assembly (PCBA) and Semiconductor industries.
Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing and processing of adhesives, coatings, polymers and plastics, sealants, biomaterials and other materials and for fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries. Visit Nordson on the web at www.nordson.com, www.twitter.com/Nordson_Corp or www.facebook.com/nordson.
