SMT, PCB Electronics Industry News

Advances in Thin, 3D and MEMS Die Bond Strength Testing

Aug 02, 2017

The reduced ratio of die thickness to die bond area

The reduced ratio of die thickness to die bond area

Warped die and substrate increases buckling loads on die that can cause it to fracture before the bond fails

Warped die and substrate increases buckling loads on die that can cause it to fracture before the bond fails

45° Self aligning top landing tool

45° Self aligning top landing tool

As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome:


The reduced ratio of die thickness to die bond area

The first difficulty is the reduction in test load area to bond area as the die becomes thinner. This is especially problematic when shear testing, because there is less area to apply the test load to. As the die thickness reduces there comes a point when the test load stress between the tool and the die reaches its yield value before the bond reaches its yield stress. The die then fails before the bond and the bond strength is not measured.


Warped die and substrate increases buckling loads on die that can cause it to fracture before the bond fails

The second difficulty relates to both shear and stud pull testing, namely the fact that die and substrate warpage with thin die are likely to occur. When shear testing, warped die and substrate increase buckling loads on the die that can cause it to fracture before the bond fails. For stud pull, warpage makes a strong and consistent glue layer thickness between the stud and die difficult.

Thirdly, when silicon is directly bonded to silicon or other similar materials the bond strength is very high. This makes testing exceptionally difficult, both when performing shear and stud pull.

Maximum recorded stress on the die edge up to 1200MPa


45° Self aligning top landing tool

To obtain the failure mode of interest i.e. a bond failure, we must be able to load the bond to the highest force possible. XYZTEC has achieved positive results by combining several techniques to significantly increase the maximum loads possible. The picture shows our patented 45° self aligning top landing tool.

Flip chip and soldered die applications have been successfully sheared, applying up to 1200MPa on the side edge of die.

Dec 21, 2016 -

Scratch and film testing throughput greatly enhanced

Dec 21, 2016 -

Scratch and film testing throughput greatly enhanced

Dec 21, 2016 -

Scratch and film testing throughput greatly enhanced

Dec 02, 2016 -

Latest Condor Sigma software release enables automatic grading

Nov 02, 2016 -

Vision enhanced materials testing

Sep 30, 2016 -

XYZTEC makes lid pull easy

Sep 08, 2016 -

XYZTEC automation features draw attention at Semicon Taiwan 2016

Sep 02, 2016 -

XYZTEC launches Condor Sigma W12 with large heater stage

Aug 23, 2016 -

HTMG represents XYZTEC in South America

Aug 19, 2017 -

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Aug 17, 2017 -

ZESTRON Americas Announces New Regional Sales Manager

Aug 17, 2017 -

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Aug 17, 2017 -

Libra Industries Announces Two 20-Year Service Awards in Q2 2017

Aug 17, 2017 -

Cirtronics Installs High-Performance X-ray Inspection Solution

Aug 17, 2017 -

Essemtec to Show New All-in-One Jetting / Placement System at SMTAI

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 17, 2017 -

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Aug 16, 2017 -

ViTrox and KIC Establish Cooperation and Connectivity

Aug 16, 2017 -

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