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CyberOptics to Demonstrate Yield-Improving WaferSense® & ReticleSense® Technology at SEMICON West

Jun 07, 2017

WaferSense and ReticleSense Auto Multi Sensors (AMS/AMSR).

WaferSense and ReticleSense Auto Multi Sensors (AMS/AMSR).

Portfolio Speeds Semiconductor Processes and Improves Long-term Yields

CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will demonstrate the WaferSense and ReticleSense Auto Multi Sensors (AMS/AMSR) at SEMICON West July 11-13 at the Moscone Center in San Francisco, California in booth #6562.

CyberOptics’ unique AMS/AMSR portfolio measures leveling, vibration, and relative humidity (RH) in an all-in-one, wireless, real-time device. Using the wafer or reticle shaped sensor with MultiView/MultiReview™ software, fab engineers can easily conduct diagnostics and see the effects of adjustments in real-time. AMS/AMSR speeds equipment alignment and set-up, lowers maintenance expenses and enhances process uniformity with objective and reproducible data.

“Semiconductor fab are increasingly specifying and requiring the use of WaferSense and ReticleSense measurement devices in various areas of the fab,” said Subodh Kulkarni, President and CEO, CyberOptics. “Whether for tool set-up or maintenance, these high-precision sensors are significantly speeding their processes, increasing equipment uptimes and improving their yields.”

At SEMICON West, CyberOptics will also showcase the widely adopted Airborne Particle Sensors (APS2/APSRQ) used to wirelessly monitor and troubleshoot airborne particles down to 0.14μm and up to 30μm bin sizes within semiconductor process equipment and automated material handling systems. The sensors quickly identify when and where the particles originate and measure the effectiveness of cleaning adjustments and repairs in real-time – saving significant time, expense and resources.

CyberOptics’ WaferSense® and ReticleSense® Line

The WaferSense measurement portfolio including the Auto Leveling System (ALS), the Auto Gapping System (AGS), the Auto Vibration System (AVS), the Auto Teaching System (ATS), the Airborne Particle Sensor (APS), the advanced Airborne Particle Sensor (APS2) and the new Auto Multi Sensor (AMS) are available in various wafer shaped form factors depending on the device, including 150mm, 200mm and 300mm wafer sizes. The ReticleSense measurement portfolio including the Airborne Particle Sensor (APSR & APSRQ) and next-generation APS2, the Auto Leveling System (ALSR) and the Auto Multi Sensor (AMSR) are available in a reticle shaped form factor.


CyberOptics Corporation (NASDAQ: CYBE) is a leading global developer and manufacturer of high precision sensing technology solutions. CyberOptics sensors are being used in general purpose metrology and 3D scanning, surface mount technology (SMT) and semiconductor markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of its key vertical markets. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.

Statements regarding the Company’s anticipated performance are forward-looking and therefore involve risks and uncertainties, including but not limited to: market conditions in the global SMT and semiconductor capital equipment industries; increasing price competition and price pressure on our product sales, particularly our SMT systems; the level of orders from our OEM customers; the availability of parts required to meet customer orders; unanticipated product development challenges; the effect of world events on our sales, the majority of which are from foreign customers; rapid changes in technology in the electronics markets; product introductions and pricing by our competitors; the success of our 3D technology initiatives; the success of CyberGage360; and other factors set forth in the Company’s filings with the Securities and Exchange Commission.

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