(Albany, NY) June 6, 2017 – YINCAE has developed a new innovative, room temperature flow, capillary underfill: SMT 88UL. SMT 88UL is a super-fast flow capillary underfill designed to flow into gaps as small as 10µm at room temperature without pre-heating a substrate. As a result, SMT 88UL eliminates additional steps required for traditional capillary underfills, thus reducing process time and costs. In addition to costs savings, SMT 88UL offers excellent reworkability, very good drop test and thermal cycling performance, as well as easy storage conditions. These results point to SMT 88UL being the next generation board level underfill for the Microelectronics industry.
Additional information regarding SMT 88UL is available by contacting YINCAE at firstname.lastname@example.org.
If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.
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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.
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