SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • New Dry-Film Negative Photoresist for MEMS and Wafer-Level Packaging

New Dry-Film Negative Photoresist for MEMS and Wafer-Level Packaging

Apr 22, 2017

Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-4014 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals.

DF4014 is extremely hydrophobic in nature, providing chemical and moisture resistance. Water will form a contact angle on the surface at > 90°. It is tougher (less brittle) than most negative photoresists on the market with a glass transition temperature of 145°C (By DMA Tan Delta) and a moderate modulus of 4.5 GPa at 25°C. DF-4014 is compatible with and can be used in contact with the EMS line of spin-coatable photoresists.

DF-4014 is the latest addition to Engineered Materials Systems’ full line of film and liquid negative photo resists formulated for making microfluidic channels on MEMS devices and integrated circuits.

For more information about the DF-4014 negative photo resist or to learn how Engineered Materials Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.

Dec 05, 2017 -

Super Thin Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Dec 03, 2017 -

Engineered Material Systems Introduces a New Low-Temperature Cure Electrically Conductive Adhesive

Oct 22, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Oct 18, 2017 -

Engineered Material Systems Introduces New UV-Cured Adhesive for Bonding Lens Holders in Camera Modules

Sep 13, 2017 -

Engineered Material Systems to Showcase Liquid and Dry Film Negative Tone Photoresists at MicroTAS

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 10, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer Level Packaging

May 01, 2017 -

Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at Intersolar Europe

Mar 22, 2017 -

Engineered Material Systems Introduces New UV Cured Adhesive for Bonding Lens Holders in Camera Modules

Mar 20, 2017 -

Engineered Material Systems, Inc. Develops Negative Photoresist for MEMS and IC Wafers

52 more news from Engineered Materials Systems, Inc. »

Dec 12, 2017 -

ECT’s Switch Probes: Cost-Efficient Solutions for Testing Electronic Assemblies

Dec 12, 2017 -

NEO Tech Design Team Wins Industry Award for Creative Solutions that Accelerate Time-to-Market

Dec 12, 2017 -

STI Has Accomplished AS9100D Certification

Dec 07, 2017 -

Nordson ASYMTEK Receives 2017 Global Technology Award for the NexJet NJ-8 Jetting System with ReadiSet 2-piece Jet Cartridge Award presented at Productronica 2017

Dec 07, 2017 -

Banner Engineering Completes Implementation of Optel Software on ASM Lines in Minneapolis and Suzhou (China)

Dec 06, 2017 -

Pan Pacific Microelectronics Symposium Program Finalized

Dec 05, 2017 -

Scienscope Promotes Don Jeka to National Sales & Marketing Manager for Its X-ray Division

Dec 05, 2017 -

Indium Corporation’s Vareha-Walsh to Present at International Electronic Recycling Congress (IERC) 2018

Dec 04, 2017 -

SCS to Discuss How Ultra-Thin Conformal Coatings Increase the Reliability of Critical Electronics during PennWell Webinar

Dec 04, 2017 -

Anda Automation Expands into Hungary

See electronics manufacturing industry news »

New Dry-Film Negative Photoresist for MEMS and Wafer-Level Packaging news release has been viewed 398 times

  • SMTnet
  • »
  • Industry News
  • »
  • New Dry-Film Negative Photoresist for MEMS and Wafer-Level Packaging
PCB, BGA Rework Services

Non-heated dispensing system