SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • MIRTEC to Exhibit Complete Line of Technologically Advanced 3D AOI and SPI Inspection Systems at IPC APEX 2017

MIRTEC to Exhibit Complete Line of Technologically Advanced 3D AOI and SPI Inspection Systems at IPC APEX 2017

Jan 11, 2017

MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #3101 at the 2017 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 14-16, 2017 at the San Diego Convention Center.

We are very excited about the products that we will be presenting at APEX 2017,” stated Brian D’Amico, President of MIRTEC’s North American Sales and Service Division. “MIRTEC will feature a total of seven (8) inspection systems specifically designed to address the full spectrum of inspection requirements associated with the electronics manufacturing industry.”

The award-winning MV-6 OMNI 3D AOI Machine is configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology which combines our 15 Mega Pixel CoaXPress Camera Technology with MIRTEC’s revolutionary Digital Multi-Frequency Quad Moiré 3D system in a newly designed cost effective platform. MIRTEC’s 15 Mega Pixel CoaXPress Vision System is a proprietary camera system designed and manufactured by MIRTEC for use with our complete product range of 3D inspection systems. MIRTEC’s Digital Multi-Frequency Quad Moiré Technology, provides true 3D inspection using a total of four (4) Programmable Digital Moiré Projectors to yield precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured the new MIRTEC MV-6 OMNI machines feature four (4) 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel Top-Down Camera. There is little doubt that this new technology has set the standard by which all other inspection equipment is measured. MIRTEC will have two (2) MV-6 OMNI’s on display one configured with a 10um lens for High-Performance applications and the other with a 15um lens for High-Speed applications.

MIRTEC’s award-winning MS-11E 3D SPI Machine is configured with MIRTEC’s exclusive 15MP CoaXPress Vision System, providing enhanced image quality, superior accuracy and incredibly fast inspection rates.

The machine uses Dual Projection Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. The MS-11e uses the same robust platform as MIRTEC’s MV-6 OMNI Series.

MIRTEC will have two (2) MS-11e’s on display one configured with a 10um lens for High-Performance applications and the other with a 15um lens for High-Speed applications.

MIRTEC’s MV-7 OMNI-QHD 3D AOI Machine features the next generation of MIRTEC’s award-winning OMNI-VISION® 3D Inspection Technology in a High-Performance AC Servo Drive Platform. This revolutionary technology combines our proprietary 15MP CoaXPress Vision System with MIRTEC’s exclusive Quantum High Definition (2048x1536) Digital Multi-Frequency 3D Projection Technology to provide unprecedented image quality, accuracy and repeatability necessary for precision inspection of SMT devices on finished PCB assemblies. This new technology will, undoubtedly, set the standard by which all other 3D inspection equipment will be measured. The MV-7 OMNI-QHD machine also features four (4) 10 Mega Pixel Side-View Cameras for inspection of Regions of Interest which are not accessible with the 15 MP Top-Down Camera.

MIRTEC’s MV-6E In-Line AOI Machine combines our exclusive 10 Mega Pixel Top-Down camera with a Precision 13.4um Telecentric Compound Lens and four (4) 10 Mega Pixel Side-View Cameras in a newly designed cost effective platform. The MV-6e is also configured with MIRTEC’s exclusive INTELLI-SCAN® 3D Laser System, providing superior lifted lead detection for gull wing devices and four-point height measurement capability for co-planarity testing of BGA and CSP devices.

The MV-3L Desktop AOI Machine is the industry’s most widely accepted five (5) camera desktop AOI system. This system is configured with one Top-Down View 10 Mega Pixel camera with a Precision 13.4um Telecentric Compound Lens and four (4) 10 Mega Pixel Side-View Cameras. It also features our exclusive INTELLI-BEAM® 3D Laser System. This advanced technology provides: four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability.

New at the IPC APEX EXPO, MIRTEC will feature an MV-3L OMNI 3D Desktop AOI Machine. The MV-3L OMNI is configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology which combines our 15 Mega Pixel CoaXPress Camera Technology with MIRTEC’s revolutionary Digital Multi-Frequency Quad Moiré 3D system in a newly designed desktop platform. MIRTEC’s 15 Mega Pixel CoaXPress Vision System is a proprietary camera system designed and manufactured by MIRTEC for use with our complete product range of 3D inspection systems. MIRTEC’s Digital Multi-Frequency Quad Moiré Technology, provides true 3D inspection using a total of four (4) Programmable Digital Moiré Projectors to yield precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured the new MIRTEC MV-3L OMNI machine features four (4) 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel Top-Down Camera.

MIRTEC’s total quality management system software, INTELLISYS® also will be on display at the IPC APEX EXPO. This software suite promotes continuous process improvement by allowing manufacturers to track and eliminate defects on inspected assemblies.

“MIRTEC has earned a solid reputation in the industry by providing unprecedented performance, quality and cost-effectiveness to the inspection environment,” continued D’Amico, “We look forward to welcoming visitors to our booth #3101 during the three-day event.”


MIRTEC is a leading global supplier of automated inspection systems to the electronics manufacturing industry. For further information, please visit www.mirtec.com

Apr 24, 2017 -

MIRTEC TO EXHIBIT A NEW INSPECTION SYSTEM WITH THE PERFECT INSPECTION SOLUTION AT NEPCON CHINA 2017

Apr 22, 2017 -

MIRTEC Europe to Exhibit at SMT/Hybrid/Packaging 2017

Apr 03, 2017 -

MIRTEC Europe to Exhibit at What's New in Electronics Live! Event

Feb 15, 2017 -

MIRTEC WINS PRESTIGIOUS 2017 SERVICE EXCELLENCE AWARD FOR TEST & INSPECTION

Jan 23, 2017 -

MIRTEC REPORTS RECORD SALES REVENUE 2016

Dec 27, 2016 -

MIRTEC Europe Awards Ankatek of Turkey Achievement Award

Dec 18, 2016 -

MIRTEC Europe Announces Most Successful Year to Date

Dec 18, 2016 -

Accurex Solutions of India Wins MIRTEC Europe 2016 Sales Award

Dec 05, 2016 -

EIT, LLC Partners with MIRTEC for Outstanding Performance and 3D Defect Detection Capability

Nov 21, 2016 -

Jaguar Partners with MIRTEC to Maintain Demanding Quality Standards

125 more news from MIRTEC Corporation »

Jun 22, 2017 -

PNC Inc. Invests in LED Laser Direct Imaging system from Miva Technologies

Jun 22, 2017 -

Addressing The Modulation of Light Output -- High Quality LED Manufacturing

Jun 22, 2017 -

Schleuniger, Inc. Receives 2017 Best of Manchester Award

Jun 21, 2017 -

Inovar Inc. Breaks Ground for New Facility on USU Innovation Campus

Jun 21, 2017 -

PNC Inc. Launches Design Webinar Series

Jun 21, 2017 -

Saelig Introduces Mercury™ T2C USB 2.0 & Power Delivery Protocol Analyzer With Type-C Connection

Jun 20, 2017 -

Europlacer Secures Fourth Award from Industry Analysts Frost & Sullivan.

Jun 20, 2017 -

In Memory of Jim D. Raby, PE

Jun 20, 2017 -

Micro-Focused IR Thermal Testing with PDR's Focused IR

Jun 20, 2017 -

SCS to Present ‘Using Conformal Coatings to Mitigate System Failures’ during upcoming Webinar

See electronics manufacturing industry news »

MIRTEC to Exhibit Complete Line of Technologically Advanced 3D AOI and SPI Inspection Systems at IPC APEX 2017 news release has been viewed 379 times

  • SMTnet
  • »
  • Industry News
  • »
  • MIRTEC to Exhibit Complete Line of Technologically Advanced 3D AOI and SPI Inspection Systems at IPC APEX 2017
Solder Paste Inspection