SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Shenmao Technology Inc.


SHENMAO America, Inc. Exhibits October 18-19 at IWLPC Introduces Semiconductor Packaging Materials

Oct 09, 2016

SHENMAO Technology, Inc., the World’s Major Solder Materials Provider distributes from 10 worldwide locations, Semiconductor Packaging Solder Spheres, Package on Package Solder Paste, Bumping Solder Paste, Dipping Flux, SMT Solder Paste, Low and High Temperature Solder Paste, Solder Preform, Wave Solder Bar, Solder Wire and Flux, Liquid/Paste Flux and PV Ribbon.

SHENMAO America, Inc. blends Solder Paste in San Jose, CA with Tin smelted from Tin Ore concentrate creating ultrapure virgin powder made at its Facility in Taiwan for distribution in North America.

For more information, please contact: SHENMAO America, Inc. www.shenmao.com Tel: +1-408-943-1755 e-mail: usa@shenmao.com

Registration to Conference and FREE Expo: http://www.iwlpc.com/register_now.cfm

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More News from Shenmao Technology Inc.

Oct 09, 2016 -

SHENMAO Technology presents a Poster at the 13 th. IWLPC At DoubleTree Airport Hotel by Hilton, San Jose, CA, USA

Oct 09, 2016 -

SHENMAO America, Inc. Exhibits October 18-19 at IWLPC Introduces Semiconductor Packaging Materials

Sep 26, 2016 -

SHENMAO Introduces Room Temperature Storable RT Series Solder Paste at SMTAI Booth # 800 September 27-28, 2016

Sep 13, 2016 -

SHENMAO Exhibits at SMTA International at Donald E Stephens Convention Center, Rosemont, Il September 27-28, 2016 Booth # 800

Aug 23, 2016 -

SHENMAO Exhibits at SEMICON TAIWAN on September 7-9, 2016 Booth # J2922 Featuring BGA Solder Spheres and Bumping Paste

Jul 11, 2016 -

SHENMAO Introduces SMF-WB02 / SMF-WB51 Water Soluble Flux At Semicon West 2016 Booth # 6467 in San Francisco

Jul 07, 2016 -

SHENMAO Introduces BGA and Micro BGA Bumping Solder Paste At Semicon West 2016 Booth # 6467 in San Francisco

Jul 02, 2016 -

SHENMAO Exhibits at SEMICON WEST July 12-14, 2016 Booth # 6467 Introduces BGA and Micro BGA Solder Spheres

Jun 05, 2016 -

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces PF606-P116 / PF606-P128 / PF606-XP LED Die Bonding Solder Pastes

May 31, 2016 -

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces Laser Soldering Paste

(15) more news from Shenmao Technology Inc.

SHENMAO America, Inc. Exhibits October 18-19 at IWLPC Introduces Semiconductor Packaging Materials news release has been viewed 61 times

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