Digicom Electronics, Inc., a technology and quality-driven electronics manufacturing services company, now generates its own nitrogen to use in its solder reflow, selective soldering, and hand soldering manufacturing processes to strengthen the bonds and improve solder adhesion. Adding nitrogen minimizes device failure and ensures printed circuit board integrity, especially for mission critical products for the medical, military and aerospace, industrial, and RF wireless industries. The addition of nitrogen is part of Digicom's Diamond Track Manufacturing Processes.
"Manufacturers must seek every way possible to eliminate failures of the devices they manufacture," said Mo Ohady, general manager, Digicom Electronics. "Many major failures result from a weakness in the solder joint that connects the wire bond to the PCB or the solder connecting the device or package to the board. Processes that seem to benefit the most are the ones that have a narrower pitch, so the narrower the pitch, the more that nitrogen use is recommended. Studies show a 50-60% reduction in defect level when using nitrogen in the reflow process. Digicom seeks to employ technologies that produce products of the highest quality. Towards that end, we have implemented nitrogen in our manufacturing process."
The nitrogen is generated and piped directly to machine inputs and work areas at a prescribed volume and pressure to achieve optimized saturation of the inert gas and to eliminate oxidation at critical moments of the soldering operation.
Digicom's white paper, Can Nitrogen Reduce Failures in Medical Devices, explores the use of nitrogen in the manufacturing process and ways to minimize device failure. A copy is available for download on the Digicom.org website at http://www.digicom.org/articles.html.
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