SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Engineered Materials Systems, Inc.


Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Smart Card Assembly Applications

Oct 04, 2016

Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, is pleased to debut its 640-35 (dam) and 640-46 (fill) dam and fill UV cured chip encapsulants for chip-on-board smart card applications.

These new encapsulants are designed to protect wire bonds and reduce the stresses associated with thermal cycling. These materials are engineered to withstand circuit board reliability test criteria.

The dam and fill UV cured chip encapsulants cure rapidly when exposed to intense UV light centered at 365nm. They have been developed for encapsulating small chips in smart card applications where fast processing is required. 640-35 and 640-46 are the latest additions to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.

For more information about the 640-35 and 640-46 dam and fill die encapsulants or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.conductives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.conductives.com.

You must be a registered user to talk back to us.

More News from Engineered Materials Systems, Inc.

Nov 14, 2016 -

New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules

Oct 04, 2016 -

Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Smart Card Assembly Applications

Sep 13, 2016 -

Engineered Materials Systems Introduces Fast Cure Conductive Adhesive for Small to Medium Size Chip Bonding

Sep 08, 2016 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Aug 08, 2016 -

New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules

Dec 05, 2015 -

Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference

Aug 26, 2015 -

Engineered Materials Systems to Exhibit DF-3000 Series Negative Film Photoresists at SEMI MEMS 2015

Aug 23, 2015 -

Engineered Material Systems Introduces DF-3050 Dry Film Negative Photoresist

Jul 21, 2015 -

Engineered Materials Systems Introduces Low-Cost Snap Cure Conductive Adhesive for Stringing Solar Modules

Jun 17, 2015 -

Engineered Material Systems Introduces DF-3005 Dry Film Negative Photoresist

(40) more news from Engineered Materials Systems, Inc.

Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Smart Card Assembly Applications news release has been viewed 74 times

Boundary Scan