[Santa Clara, CA – September 30, 2016] – BEAM ON TECHNOLOGY is excited to announce the launching of a new mobile app that provides quick and easy to understand calculations for predicting paste release, solder volumes, and even solder paste powder recommendation. The app works for both Android and iOS platform.
The Area Ratio Calculator app is the only app made specifically for solder paste stencil printing and works for both your smartphone or tablet. The app takes the dimensions of a specific aperture once the shape is selected, then allows the user to select foil thickness. Instantly, an algorithm displays the area ratio, with easy to understand color identifiers that infer solder paste transfer efficiency.
The Area Ratio Calculator also provides supplemental data such as aspect ratio, solder paste volume in cubic mils, as well as suggested solder powder type. This feature is beneficial because it allows for quick reference to any current work being looked into, in an easy to read setting.
The Area Ratio Calculator app by Beam On Technology is now free to download and available through the Apple Store or Google Play.
Beam On Technology Corporation was established in October 1992, founded by manufacturing engineers with extensive knowledge and expertise in the assembly process. Our sole purpose was to provide integrated service products to the SMT assembly industry engineered for ease of use while impacting yield, and this continues to be our goal.