SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2017 in San Diego

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2017 in San Diego

Sep 22, 2016

IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 15, 2017, and will be displayed throughout the event, offering additional visibility.

Technical poster presentations are being sought on all relevant electronics topics, including design, materials, assembly, processes and equipment, especially:

• 3D Printing in Electronics Manufacturing

• Automation in Electronics Manufacturing

• Adhesives

• Advanced Technology

• Area Array/Flip Chip/0201 Metric

• Assembly and Rework Processes

• BGA/CSP Packaging

• Black Pad and Other Board Related Defect

Issues

• BTC/QFN/LGA/MLF Components

• Business & Supply Chain Issues

• Cleaning

• Conformal Coatings

• Corrosion

• Counterfeit Electronics

• Design

• Electromigration

• Electronics Manufacturing Services

• Embedded Passive & Active Devices

• Environmental Compliance

• Graphene in Electronics Manufacturing

• Lean Six Sigma

• LED Manufacturing

• Failure Analysis

• Flexible Circuitry

• HDI Technologies

• Head-on-Pillow

• Board and Component Warpage

• High Speed, High Frequency & Signal

Integrity

• Industry 4.0

• Lead-Free Fabrication, Assembly &

Reliability

• Miniaturization

• Nanotechnology

• Optoelectronics

• Packaging & Components

• PCB Fabrication

• PCB and Component Storage & Handling

Performance

• Quality & Reliability

• Photovoltaics

• PoP (Package-on-Package)

• Printed Electronics

• Reshoring

• RFID Circuitry

• Robotics

• Soldering

• Surface Finishes

• Test, Inspection & AOI

• Tin Whiskers

• 2.5-D/3-D Component Packaging

• Underfills

• Via Plugging & Other Protection

• Wearables

An abstract of up to 300 words summarizing technical and previously unpublished work covering case histories, research and discoveries should be submitted by October 22, 2016, to www.IPCAPEXEXPO.org/CFPosters.

For more information about poster participation or other opportunities to participate in IPC APEX EXPO, contact Jasbir Bath, IPC technical conference director, at JasbirBath@ipc.org or Toya Richardson, IPC technical programs coordinator, at ToyaRichardson@ipc.org.


IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
 

Jun 20, 2017 -

Zentech Manufacturing, Inc. First to Recertify for IPC Qualified Manufacturers Listing

Jun 14, 2017 -

IPC Submits Comments to Trump Administration Regarding Modernization of NAFTA

Jun 07, 2017 -

IPC Hand Soldering Competition Winner Crowned at SMT Hybrid Packaging 2017

Jun 01, 2017 -

North American PCB Order Growth Pushes Book-to-Bill Ratio Higher

May 16, 2017 -

IPC Report Details How PCB Manufacturers Meet Current and Future Technology Demands

May 15, 2017 -

Taiwan Union Technology Corporation Receives the First IPC-4101 Qualified Products Listing Certification

May 15, 2017 -

IPC to Host Fourth Annual Reliability Forum in Germany

May 04, 2017 -

Electronics Industry Leaders Meet with Members of Congress and Leaders of Trump Administration Executives urge policymakers to support pro-manufacturing policies

May 04, 2017 -

IPC Welcomes New Senior Director of Learning and Professional Development

May 03, 2017 -

North American PCB Order Growth Boosts Book-to-Bill Ratio

832 more news from Association Connecting Electronics Industries (IPC) »

Jun 22, 2017 -

PNC Inc. Invests in LED Laser Direct Imaging system from Miva Technologies

Jun 22, 2017 -

Addressing The Modulation of Light Output -- High Quality LED Manufacturing

Jun 22, 2017 -

Schleuniger, Inc. Receives 2017 Best of Manchester Award

Jun 21, 2017 -

Inovar Inc. Breaks Ground for New Facility on USU Innovation Campus

Jun 21, 2017 -

PNC Inc. Launches Design Webinar Series

Jun 21, 2017 -

Saelig Introduces Mercury™ T2C USB 2.0 & Power Delivery Protocol Analyzer With Type-C Connection

Jun 20, 2017 -

Europlacer Secures Fourth Award from Industry Analysts Frost & Sullivan.

Jun 20, 2017 -

In Memory of Jim D. Raby, PE

Jun 20, 2017 -

Micro-Focused IR Thermal Testing with PDR's Focused IR

Jun 20, 2017 -

SCS to Present ‘Using Conformal Coatings to Mitigate System Failures’ during upcoming Webinar

See electronics manufacturing industry news »

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2017 in San Diego news release has been viewed 353 times

  • SMTnet
  • »
  • Industry News
  • »
  • IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2017 in San Diego
Plasma prior Conformal Coating

reflow oven profiler