Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.
Session 1 on Wednesday, October 26th will focus on “Processes for Achieving Reliability and Ruggedization.”
Dr. Bruno Toll, R&D Director at Kester Corporation will present the use of a non-standard test method to assess the reliability of flux residues trapped under bottom terminated components.
Mark McMeen, V.P. of Engineering at STI Electronics, will focus on design strategies for outgassing flux residues under QFN components to improve reliability should errant flux residues be trapped under the component terminations.
Kelly Flanagan, Materials Scientist at Rockwell Collins, will focus her talk on spot IC extractions to benchmark end-use environments.
Chrys Shea, Principal at Shea Engineering, will present Stencil Printing research and video evidence for improving transfer efficiency.
Come learn about these valuable lessons and more at the IPC/SMTA Cleaning and Conformal Coating Conference.
The link http://www.ipc.org/calendar/2016/cleaning-coating/agenda.htm provides a detailed conference agenda.