SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Materials Systems Introduces Fast Cure Conductive Adhesive for Small to Medium Size Chip Bonding

Engineered Materials Systems Introduces Fast Cure Conductive Adhesive for Small to Medium Size Chip Bonding

Sep 13, 2016

Fast Cure Conductive Adhesive for Small to Medium Size Chip Bonding.

Fast Cure Conductive Adhesive for Small to Medium Size Chip Bonding.

Engineered Materials Systems, a leading global supplier of conductive interconnect materials for electronics applications, today announced its new EMS 561-338 Fast Cure Conductive Adhesive for die attach applications with small to medium size die. EMS 561-338 is designed to cure in less than one minute at 150ºC.

The adhesive is stress-absorbing to withstand the rigors of thermal cycling and features excellent conductive stability. The material can be applied by stencil printing or needle dispensing.

The 561-338 conductive die attach adhesive is the latest addition to Engineered Conductive Materials’ full line of conductive adhesives for circuit assembly applications. For more information about the EMS 561-338 Fast Cure Conductive Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com .

Dec 05, 2017 -

Super Thin Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Dec 03, 2017 -

Engineered Material Systems Introduces a New Low-Temperature Cure Electrically Conductive Adhesive

Oct 22, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Oct 18, 2017 -

Engineered Material Systems Introduces New UV-Cured Adhesive for Bonding Lens Holders in Camera Modules

Sep 13, 2017 -

Engineered Material Systems to Showcase Liquid and Dry Film Negative Tone Photoresists at MicroTAS

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 10, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer Level Packaging

May 01, 2017 -

Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at Intersolar Europe

Apr 22, 2017 -

New Dry-Film Negative Photoresist for MEMS and Wafer-Level Packaging

Mar 22, 2017 -

Engineered Material Systems Introduces New UV Cured Adhesive for Bonding Lens Holders in Camera Modules

52 more news from Engineered Materials Systems, Inc. »

Jan 18, 2018 -

KYZEN Partners with Aurotech to Service Philippines Customers Faster and Better

Jan 18, 2018 -

MIRTEC Europe Celebrates 10 Years of Consistent Inspection Innovation

Jan 18, 2018 -

Inovar, Inc. Celebrates 20 years as a Leading Electronic Manufacturing Company Milestone recommits the company to its purpose and core values

Jan 18, 2018 -

Saelig Introduces RSA5000 3.2/6.5GHz Real-Time Spectrum Analyzers

Jan 18, 2018 -

Cobar Solder Products Inc. at IPC APEX EXPO 2018

Jan 17, 2018 -

Inovaxe to Showcase Its Intelligent Ultra-Lean Total Material Handling and Storage Solution at SMTA Space Coast Expo

Jan 17, 2018 -

Schleuniger Introduces CableCoiler 1450 Single Pan Coiling System

Jan 17, 2018 -

Schleuniger Introduces CableCoiler 1450 Single Pan Coiling System

Jan 17, 2018 -

Schleuniger Introduces CableCoiler 1450 Single Pan Coiling System

Jan 17, 2018 -

CalcuQuote Exhibits at IPC APEX Expo 2018

See electronics manufacturing industry news »

Engineered Materials Systems Introduces Fast Cure Conductive Adhesive for Small to Medium Size Chip Bonding news release has been viewed 640 times

  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Materials Systems Introduces Fast Cure Conductive Adhesive for Small to Medium Size Chip Bonding
Used SMT Equipment

Europlacer iineo+ SMT pick and place with integrated component tester