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Engineered Materials Systems Introduces Fast Cure Conductive Adhesive for Small to Medium Size Chip Bonding

Sep 13, 2016

Fast Cure Conductive Adhesive for Small to Medium Size Chip Bonding.

Fast Cure Conductive Adhesive for Small to Medium Size Chip Bonding.

Engineered Materials Systems, a leading global supplier of conductive interconnect materials for electronics applications, today announced its new EMS 561-338 Fast Cure Conductive Adhesive for die attach applications with small to medium size die. EMS 561-338 is designed to cure in less than one minute at 150ºC.

The adhesive is stress-absorbing to withstand the rigors of thermal cycling and features excellent conductive stability. The material can be applied by stencil printing or needle dispensing.

The 561-338 conductive die attach adhesive is the latest addition to Engineered Conductive Materials’ full line of conductive adhesives for circuit assembly applications. For more information about the EMS 561-338 Fast Cure Conductive Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com .

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