SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from kurtz ersa Corporation

Ersa to Present on Void Reduction in Reflow Soldering during SMTAI

Sep 07, 2016

Viktoria Rawinski, Assistant to the CEO.

Viktoria Rawinski, Assistant to the CEO.

Kurtz Ersa North America, a leading supplier of electronics production equipment, is pleased to announce that Viktoria Rawinski, Assistant to the CEO of the Kurtz Ersa Group and head of the Kurtz Ersa Company Museum and the Corporate History Department, will present the paper entitled, “Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate – Process Integration in Industrial Production,” during SMTA International. The presentation is scheduled to take place during Session MFX4, entitled, “Reflow and Soldering Technology: Void Reduction” on Wednesday, September 28, 2016 from 10:30 a.m. to 12 p.m. in Room 49.

Due to the ongoing trend towards miniaturization of power components, the lossless thermal conductivity of solder joints in SMT processes is gaining increasingly more importance. Voids developing during soldering reduce the actual thermal transfer and can cause thermal damage of the power components up to their failure. For this reason, Ersa GmbH has developed a new technique to minimize the formation of those voids during the soldering process and has tested its practicability in industrial soldering processes as well as its influence on process time.

The insights of the feasibility study were the basis for the integration of the void-less technique into an industrial production process. The quality of the solder joint concerning the void rate is strongly influenced by the duration of the void-less process. Therefore, multifold tests were made, contrasting the influence of the process duration as well as the as the influence of the different types of sweeps.

Rawinski graduated from the University of Applied Science in Wuerzburg. She completed Silicat Research (Center Smart Materials) at the Fraunhofer Institute as Engineer for Applied R&D. Her varied fields of research include publications on the dielectric elastomer actuators and the “System Reliability of Piezo-fiber Sensors with Integrated Electronics.” Rawinski leads several emerging technology projects for Ersa GmbH.

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