SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

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New NPL Method for Testing Reliability of Electronics in Condensing Environment FREE Webinar

Sep 06, 2016

Clean or No Clean Testing

Clean or No Clean Testing

NPL have developed a new test method to control the rate of condensation on to printed board assemblies during environmental testing like SIR or conformal coating assessment. The method provided considerable improvements on existing industry standard tests and the EI Group are currently running a multi partner project to refine the test and fine criteria.

This FREE webinar will provide an overview of the test methods and some results from other NPL SIR assessment projects in Europe register at https://attendee.gotowebinar.com/register/796849433116420865

Topics Covered:

Review of existing test methods
Disadvantages of industry procedures
NPL condensation test benefits
Results of selected production trials

The webinar will run for between 45-60min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented and links to NPL reports will be provided after the webinar

You must be a registered user to talk back to us.

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