SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Shenmao Technology Inc.


SHENMAO Exhibits at SEMICON TAIWAN on September 7-9, 2016 Booth # J2922 Featuring BGA Solder Spheres and Bumping Paste

Aug 23, 2016

SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, MBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.76, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 11 worldwide SHENMAO Technology locations.

SHENMAO High Drop-Resistance Alloy PF902-S (SAC0307X) greatly increases reliability and performance of Portable Electronic Devices drop test.

For 43 years, as the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Solder Wire and Flux, Solder Preforms, LED Die Attach Paste, Laser Soldering Paste, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux and PV Ribbon.

For more information, please contact: SHENMAO Technology, Inc. www.shenmao.com +886-3-416-0177 e-mail: solder@shenmao.com To Register: https://ishk.infosalons.biz/reg/semicon16/registeren/StepOne.aspx?type=

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More News from Shenmao Technology Inc.

Oct 09, 2016 -

SHENMAO Technology presents a Poster at the 13 th. IWLPC At DoubleTree Airport Hotel by Hilton, San Jose, CA, USA

Oct 09, 2016 -

SHENMAO America, Inc. Exhibits October 18-19 at IWLPC Introduces Semiconductor Packaging Materials

Sep 26, 2016 -

SHENMAO Introduces Room Temperature Storable RT Series Solder Paste at SMTAI Booth # 800 September 27-28, 2016

Sep 13, 2016 -

SHENMAO Exhibits at SMTA International at Donald E Stephens Convention Center, Rosemont, Il September 27-28, 2016 Booth # 800

Aug 23, 2016 -

SHENMAO Exhibits at SEMICON TAIWAN on September 7-9, 2016 Booth # J2922 Featuring BGA Solder Spheres and Bumping Paste

Jul 11, 2016 -

SHENMAO Introduces SMF-WB02 / SMF-WB51 Water Soluble Flux At Semicon West 2016 Booth # 6467 in San Francisco

Jul 07, 2016 -

SHENMAO Introduces BGA and Micro BGA Bumping Solder Paste At Semicon West 2016 Booth # 6467 in San Francisco

Jul 02, 2016 -

SHENMAO Exhibits at SEMICON WEST July 12-14, 2016 Booth # 6467 Introduces BGA and Micro BGA Solder Spheres

Jun 05, 2016 -

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces PF606-P116 / PF606-P128 / PF606-XP LED Die Bonding Solder Pastes

May 31, 2016 -

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces Laser Soldering Paste

(15) more news from Shenmao Technology Inc.

SHENMAO Exhibits at SEMICON TAIWAN on September 7-9, 2016 Booth # J2922 Featuring BGA Solder Spheres and Bumping Paste news release has been viewed 121 times

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