SMT, PCB Electronics Industry News

3D SPI with Unambiguous Z Referencing and Warpage Compensation

Aug 22, 2016

Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, will exhibit with AXIS AUTOMATION in Hall 3 – Booth 3141 at ELECTRONICA India, scheduled to take place September 21-23, 2016 at the BIEC- Bangalore International Exhibition Center. Vi TECHNOLOGY will showcase its award-winning PI series 3D SPI. The PI Series has been recognized by the industry as the most innovative SPI product since the introduction of Moiré systems.

PI’s 360° Moiré technology offers a unique textural review image and outstanding performance and accuracy, through unambiguous Z referencing and warpage compensation. PI is the only inspection system to program automatically. Solder paste and glue dots inspection quality is therefore independent on programmers’ training.


Vi TECHNOLOGY is a global designer, manufacturer and supplier of a wide range of innovative inspection equipment and software solutions for PCB assembly. Vi TECHNOLOGY serves very demanding market segments including telecoms, consumer, computer, automotive, infrastructure, industrial and medical.For more information, visit www.vitechnology.com.

Apr 22, 2018 -

Vi TECHNOLOGY to showcase the most innovative SPI product since the introduction of Moiré systems

Apr 16, 2018 -

Vi TECHNOLOGY to exhibit advanced 3D inspection solutions at NEPCON China

Mar 01, 2018 -

Vi TECHNOLOGY Discusses the Importance of German Manufacturing at InnovationsFORUM Germany

Feb 01, 2018 -

3D SPI from Vi TECHNOLOGY at ENOVA Lyon

Jan 28, 2018 -

Vi TECHNOLOGY to Introduce New Sigma Line Module at APEX

Oct 17, 2017 -

Vi TECHNOLOGY prepares for a busy productronica

Sep 05, 2017 -

Vi TECHNOLOGY Couples Its 5K3D AOI with the PI Series 3D SPI at ENOVA Paris

Aug 23, 2017 -

Vi TECHNOLOGY Combines 3D Inspection with SIGMA Link for Smart Factories

Jul 18, 2017 -

Vi TECHNOLOGY Makes a Big Presence at NEPCON South China with Inspection Solutions in Three Booths

Jul 09, 2017 -

Vi TECHNOLOGY Moves Into New Territories

59 more news from Vi TECHNOLOGY »

Apr 23, 2024 -

New Energy Automotive: I.C.T.'s Conformal Coating Line Expertise in Mexico

Apr 22, 2024 -

ZESTRON Welcomes Whitlock Associates as new Addition to their Existing Rep Team in Florida

Apr 22, 2024 -

IPC Bestows Posthumous Hall of Fame Award to Industry Icon Michael Ford

Apr 22, 2024 -

Two Long-time IPC Volunteers Receive Dieter Bergman IPC Fellowship Award

Apr 22, 2024 -

Camera Microscopes: A Game Changer for Electronics Manufacturing

Apr 22, 2024 -

SMTXTRA Appoints MaRC Technologies as Representative for the Pacific Northwest

Apr 22, 2024 -

ZESTRON Welcomes Angela Marquez as Head of Business Unit, Latin America

Apr 22, 2024 -

Apollo Seiko's J CAT LYRA + ARC 5000 Goes Beyond Traditional Soldering at SMTA Wisconsin

Apr 22, 2024 -

SMTXTRA Partners with Kurt Whitlock Associates to Expand Presence in Florida

Apr 22, 2024 -

IMAPS & IPC to Host Onshoring Workshop April 29 – May 1, 2024, in Arlington, Virginia

See electronics manufacturing industry news »

3D SPI with Unambiguous Z Referencing and Warpage Compensation news release has been viewed 715 times

Thermal Interface Material Dispensing

ICT Total SMT line Provider