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Nordson to Showcase Market-Leading Test and Inspection Systems at NEPCON South China

Jul 30, 2016

Quadra™ 7 with 0.1μm sub-micron feature recognition.

Quadra™ 7 with 0.1μm sub-micron feature recognition.

Nordson DAGE and Nordson MATRIX, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Stand 1H20 at NEPCON South China, scheduled to take place Aug. 30-Sept. 1, 2016 at the Shenzhen Convention & Exhibition Centre. Nordson DAGE will showcase its new 4th generation, ultra-high resolution, off-line MXI X-ray system – the Quadra™ 7 and 4000Plus Bondtester. Nordson MATRIX will showcase its high-speed X3 Inline AXI system.

Nordson DAGE’s flagship system – the new Quadra™ 7 with 0.1μm sub-micron feature recognition – comes equipped with two 4K UHD displays and 8 million pixels to fully show the 50μm pixel pitch and 6.7MP image size of the Aspire FP™ detector.

Nordson DAGE will also highlight its award-winning 4000Plus Bondtester with Camera Assist Automation, ideally suited for pull-and-shear testing of wafer interconnections, lead frames, hybrid microcircuits or automotive electronic packages.

The Nordson MATRIX X3 is an automated inspection system designed for sophisticated high-speed inspection in SMT production. Transmission X-ray Technology with patented Slice-Filter-Technique™ (SFT), Off-Axis technology and 3D SART present a flexible solution package for the in-line inspection of single & double-sided PCB assemblies. The X3 movable detector axes allow high-speed off-axis image acquisition from different angles and directions with maximum image quality and resolution.


Nordson DAGE, MATRIX and YESTECH, units of Nordson Corporation (NASDAQ: NDSN), manufacture and support a complete range of industry leading Test and Inspection products for the electronics industry. Offering an award winning portfolio of Automated Optical Inspection (AOI), Automated X-ray Inspection (AXI), Manual X-ray Inspection (MXI), Bond Testing, Micro Materials Testing and Wafer X-ray Metrology systems, Nordson’s family of Test and Inspection products bring powerful and cost effective solutions to the Printed Circuit Board Assembly (PCBA) and Semiconductor industries.

Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing and processing of adhesives, coatings, polymers and plastics, sealants, biomaterials and other materials and for fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries. Visit Nordson on the web at www.nordson.com, www.twitter.com/Nordson_Corp or www.facebook.com/nordson.

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