SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • SMTA INTERNATIONAL is 2 MONTHS AWAY! VISIT YINCAE BOOTH # 129 September 27th & 28th

SMTA INTERNATIONAL is 2 MONTHS AWAY! VISIT YINCAE BOOTH # 129 September 27th & 28th

Jul 26, 2016

(Albany, NY) 7/26/2016 – SMTA International is 2 months away! The tradeshow will take place at the Donald Stephens Convention Center, Rosemont, IL from September 27th to 28th.  YINCAE hopes that you will stop by our Booth 129 to learn more about YINCAE and the innovative products we have to offer. 

Dr. Wusheng Yin, the president of YINCAE Advanced Materials, is going to be speaking at the conference on “Room Temperature Fast Flow Reworkable Underfill for LGA.”.  The presentation will be on held on Wednesday, Sept. 28th from 10:30am-12:00pm in room FSA3.

YINCAE offers a variety of exclusive Adhesives, Thermal Interface, and Chip/Board/Packaging level materials that have been adopted by leading contract manufacturers and Tier 1 Microelectronic suppliers. YINCAE innovated the WORLD's FIRST Lead-Free Solder Joint Encapsulation Adhesive solutions for wafer level, flip chip, POP, LGA, BGA and many more applications. YINCAE offers SJEA for low, medium, and high temperature solder alloy applications for your individualized needs.

YINCAE Advanced Materials, LLC hopes that you will join us at the conference to learn about YINCAE and the solutions that we have to offer. We have exclusive products that no other company has developed. YINCAE hopes to see you there at the conference. Please visit us at booth 129!

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

                                                                                                                           * * * * * * * * * *

Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

                                                                                                                                 ###

                                                                            The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

Jun 20, 2017 -

SEMICON West is 1 Month Away, Visit Yincae at Booth 5248

Jun 19, 2017 -

DA 90 Low Temperature Die Attach Adhesive Series Materials

Jun 13, 2017 -

SMT 158UL Highly Filled Room Temperature Underfill

Jun 06, 2017 -

SMT 88UL Super-Fast Flow Room Temperature Underfill

Jun 05, 2017 -

New Innovative Solder Joint Encapsulant Paste: SMT 256EP

May 04, 2017 -

PRESS RELEASE: SEMICON West July 11-13, 2017

Jan 24, 2017 -

PRESS RELEASE: New Product Announcement

Jan 18, 2017 -

Press Conference at IPC APEX EXPO 2017

Jan 13, 2017 -

IPC APEX EXPO is 1 month away

Aug 24, 2016 -

SMTA INTERNATIONAL JUST A MONTH AWAY! VISIT YINCAE BOOTH #129 September 27th & 28th

17 more news from YINCAE Advanced Materials, LLC. »

Jul 21, 2017 -

Epec Now Offering PCB Layout and Design Services

Jul 21, 2017 -

Help customer solve problems of 750L machine

Jul 19, 2017 -

Digicom Electronics Receives AS9100:2016 (RevD) Aerospace and ISO 9001:2015 Certifications

Jul 19, 2017 -

Conecsus Presents SMT Metals Waste Recycling Solutions at SMTAI 2017

Jul 19, 2017 -

New Metcal HTD Tips & Hand-piece Increase Throughput and Save Money

Jul 19, 2017 -

Altus Supports Bespoke Desktop Robots for Automated Soldering, from ATN Germany

Jul 19, 2017 -

STI Acquires Fischerscope X-ray XDAL 237

Jul 19, 2017 -

COT Reduces Prices on SMT Nozzles & Consumables

Jul 19, 2017 -

Cogiscan Partners with iBASEt for Automated Electronics Assembly

Jul 19, 2017 -

International Wafer-Level Packaging Conference (IWLPC) Program Announced and Registration Now Open

See electronics manufacturing industry news »

SMTA INTERNATIONAL is 2 MONTHS AWAY! VISIT YINCAE BOOTH # 129 September 27th & 28th news release has been viewed 444 times

  • SMTnet
  • »
  • Industry News
  • »
  • SMTA INTERNATIONAL is 2 MONTHS AWAY! VISIT YINCAE BOOTH # 129 September 27th & 28th
PCB machines

Fully automatic selective soldering stations