SMT, PCB Electronics Industry News

Soldering Support Online or On Site

Jul 10, 2016

No Soldering defects just solutions

No Soldering defects just solutions

All our training workshops are run on site at your manufacturing facility, conference or exhibition venues worldwide. We offer the largest range of topics in the industry.

he content of any workshop may be modified to suit your specific requirements and can include training poster sets which may then be used for further staff education. If you require a specific training workshop and don’t see it listed, please Contact Us at  for further information. Shorter versions of all these topics can also be run online for your engineering teams

Selected workshop topics include:

Guide to MSL/MSD Moisture Sensitive Devices & PCB Control
LED Design, Assembly & Soldering Process Issues – Causes & Cures
Cleaning Printed Circuit Assemblies, Design & Process Control
Package on Package (PoP), STACK Assembly, Rework and Inspection
LGA (Land Grid Array) QFN (Quad Flat No-lead) Design and Assembly
Laser & Robotic Iron Soldering for Electronics Assembly
Printed Circuit Board Inspection and Quality Control
Practical Failure Analysis in Printed Board Assembly
High Temperature Assembly & Soldering Processes
Lead-Free Selective Soldering, Design, Process Challenges and Practical Solutions
Hands on Soldering and Desoldering
Hands on Surface Mount Rework and Repair
Counterfeit Component Workshop- Causes and Cures
Troubleshooting Your Lead Free Assembly Yields – On Site or Offshore
Flexible Circuit Board Design and Assembly with Lead-Free Alloys
Lead-Free Wave Soldering Process Troubleshooting
Successful X-Ray and Optical Inspection in a tin/lead or Lead-Free Process
Lead-Free Selective Soldering, Design, Quality Control and Practical Solutions
Vapour Phase & Convection Reflow For Lead Free– Selecting a Reflow Process
Conformal Coating Application and Inspection
BGA, CSP and Flip Chip PCB Design and Assembly
Counterfeit Component – Causes and Cures Workshop
Step by Step Ball Grid Array & Surface Mount Rework and Repair
0201 0155 & Smaller Component Design, Assembly and Inspection
Basic Printed Circuit Board Manufacture and Process Defects
Producing and Presenting Technical Presentations
Double Sided Reflow Design and Assembly
Selecting Solderable Finishes for BGA and Fine Pitch Assembly
Ball Grid Array Technology Design, Assembly and Inspection
Practical X-Ray Inspection of BGA and Quality Standards
Printed Board Design for Manufacture and Assembly in Lead Free
Pin in Hole/Intrusive Reflow Design and Assembly

May 21, 2017 -

Cleaning & Contamination Defects Photo CD-ROM

Apr 13, 2017 -

Plan your engineering process improvement with a monthly online webinar

Mar 22, 2017 -

Surface Mount Assembly & Defect Photo CD

Mar 08, 2017 -

Lead Free & Tin/Lead Wave Soldering Defect Guide to Download

Mar 06, 2017 -

0201, 01005 & Smaller Soldering, Assembly & Defect Photo CD

Mar 06, 2017 -

Archive Webinar Recordings on Soldering, PCB Assembly & Inspection

Mar 06, 2017 -

Hands on Master Class Series from Bob Willis

Feb 20, 2017 -

SMT and Conventional Photo CD ROM

Feb 11, 2017 -

Join Assembly Soldering Inspection Defects LinkedIn Group

Feb 05, 2017 -

Solder Ball Elimination – In Wave, Selective & Reflow Webinar

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Jun 28, 2017 -

Vapor Phase Manufacturer IBL Technologies Holds 30 Year Anniversary Event

Jun 28, 2017 -

COT Completes $2 Million Expansion of Its Gainesville, Georgia Manufacturing Headquarters

Jun 28, 2017 -

Ersa Versaflow Level II Application Training Course

Jun 28, 2017 -

SMTA Releases Wave Soldering Online Course

Jun 27, 2017 -

Flying Probe, Functional Test & Inline Test – Visit Acculogic at SMTA Ohio Expo

Jun 27, 2017 -

VJ Technologies and Datest Partner in West Coast Inspection Services, Showroom and Demonstration Center.

Jun 26, 2017 -

Altus get SMART with Koh Young’s Innovative New Software

Jun 26, 2017 -

Ersa to Hold Versaflow 3 Level II Maintenance Training Course

Jun 25, 2017 -

Libra Industries’ Christopher R. Howell Memorial Foundation Awards $20,000 in Scholarships during Annual Golf Outing

Jun 25, 2017 -

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

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