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News from Machine Vision Products, Inc


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  • Machine Vision Products to Demonstrate Diverse Microelectronics and Packaging Inspection Toolbox of its Microelectronics AOI Platforms at Semicon West 2016

Machine Vision Products to Demonstrate Diverse Microelectronics and Packaging Inspection Toolbox of its Microelectronics AOI Platforms at Semicon West 2016

Jul 08, 2016

MVP 850 DWMS

MVP 850 DWMS

MVP 2020 DWMS

MVP 2020 DWMS

Machine Vision Products to Demonstrate Diverse Microelectronics and Packaging Inspection Toolbox of its Microelectronics AOI Platforms at Semicon West 2016

Carlsbad, CA – July 8, 2016: Machine Vision Products (MVP) today announced it would be demonstrating their diverse inspection toolbox on the MVP 850 Platform for Microelectronics and Packaging at the Semicon West 2016 exhibition. Applications will include Lead Frame inspection for die placement, epoxy and wire bond as well as demonstrating new surface inspection capabilities. The exhibition is at the Moscone Center in San Francisco from July 12-14 2016. Machine Vision Products are exhibiting at booth #6471 in the North Hall.

MVP Microelectronics AOI platforms have been designed for high accuracy, high speed inspection for multiple applications. With resolution and repeatability a critical factor, the AOI platforms can be configured to provide a 1um pixel resolution size.

MVP Microelectronics AOI platforms can be configured for Lot Solutions including Magazine Lifters/Indexers, Jedec Trays, Waffle Packs, and Auer Boats. MVP’s inline solutions allow for both single and dual lane processing, strip handling and in-line wafer handing. MVP also works to deliver custom handling solutions for specialized inspection applications.

MVP Microelectronics AOI Applications

Lead Frame inspection including:

  • Die Placement Metrology
  • Wire Bond
  • Epoxy Spread and Bridging
  • Lead Frame Integrity

BGA inspection including:

  • 2D and 3D high-resolution imaging
  • Ball Diameter, Shape, Offsets and Damage;
  • Coplanarity and Height Measurements

Metrology inspection including:

  • Die Alignment Metrology on the substrate
  • Edge, FM and Surface  
  • Flux and Paste

Dice Wafer Inspection including:

  • Die Metrology
  • Die Surface and Edge Chips

Traceability Products and Image Archiving

MVP is also a provider of software solutions that extend the power of our AOI technologies to provide advanced traceability options for our customers.

MVP will be demonstrating its AutoNetworker, a centralized database with the flexibility to be configured for a host of data mining options. For SMT and Microelectronics, both measurement and pass/fail data can be stored for every product, from every lot or work order and scalable dependent on the customer’s requirements.  Data can be retained based on a customer’s own requirements from short term to endless data collection.

AutoNetworker is a valuable tool designed with the ability to quickly create reports for quality managers, operation managers and process engineers via a web-based interface accessible from any intranet location.

A significant new development to be demonstrated by MVP is the new Image Archiving capability of the AutoNetworker. Providing the ability to save every defect image detected by multiple AOI machines MVP now provide a scalable solution for Image Archiving, For critical processes where quality is of critical nature the ability to provide visual traceability as well as data traceability is essential. MVP now delivers that capability.

Announcing the new MVP 2020 DWMS

MVP is also announcing the new 2020 DWMS AOI solution for Lead Frame inspection.

The MVP 2020 DWMS can be configured for cleanrooms up to Class 100. The 2020 includes MVP’s integrated loader and unloaders and gripper based transport to and from the inspection bay. For Class 100 configuration Stainless Steel skins and Laminar Fan/Filter Units are provided as options.

The 2020 DWMS is a modular solution providing options for additional ink marking, Lead Frame puncher and wire ripper capabilities within its review/defect handling stage. Dependent on Lead Frame density the 2020 DWMS is capable of producing UPH of better than 150,000. MVP is now shipping the first 2020 DWMS orders.

MVP continues to lead the global inspection arena by developing all of their product offerings. This provides a much better cost structure to the end user. Additionally, because all development is performed in-house, the support structure is second to none. With over 20 years of leadership, MVP is taking multiple steps to continue to provide the overall lowest cost of ownership when compare to any competitor globally. For additional information on this unique solution, please visit us at www.machinevisionproducts.com  or visit us at booth #6471 at Semicon West 2016 where we can discuss your application requirements.

For further information contact:

Email: sales@visionpro.com

Phone: +1-760-438-1138

About Machine Vision Products, Inc.
Machine Vision Products is a market innovator and leader in imaging technologies for Surface Mount, Microelectronics and Packaging Technologies. Machine Vision Products provide solutions for both commercial and military applications. Machine Vision Products operate globally with direct operations in the US, China, Malaysia and the UK, with additional representation in countries throughout North America, Europe and Asia.

www.machinevisionproducts.com


 

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