Computrol, Inc., a world-class provider of mid- to low-volume, high-mix electronic manufacturing services to OEMs, today announced that it has purchased and installed an Assembléon iFlex T2 and two iFlex H1s from Kulicke & Soffa. The lane iFlex T2 is a multifunctional or line-balancing solution with a large component range. The iFlex H1 end-of-line solution offers odd-form and gripper capabilities.
Computrol added the iFlex T2 to its existing Assembléon SMT line at its Meridian, ID plant, and installed one iFlex H1 on each end. “The modular iFlex was easy to install and supported by smart software tools that are easy to program without hardware reconfiguration,” said James Spencer, Engineering Manager for Computrol. “Our K & S lines have an amazing combination of speed, flexibility and placement accuracy that helps us to exceed the expectations of our demanding customer base.”
iFlex T2 is aimed at flexible placements (2 placement robots, placement speeds of 24,000 cph, 128 twin tape feeder positions). iFlex H1 has been designed for ICs and fine-pitch placements (1 placement robot, placement speed of 7,100 cph, max 146 twin tape feeder positions/max 30 tray positions). The added flexibility enables Computrol to assemble high‐quality PCBs at any quantity, no matter how much variety. This makes iFlex ideal for Computrol’s high product mix environment.
For more information about Computrol’s manufacturing capabilities, visit www.computrol.com.
Computrol, Inc., with manufacturing facilities in Meridian, Idaho and Orem, Utah, is a leading national provider of high-quality, low-volume electronics manufacturing capabilities, serving military, medical, aerospace, broadcast and general industry customers. For more information about Computrol, Inc., visit www.computrol.com.
Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and manufacture of semiconductor, LED and electronic assembly equipment. As a pioneer in this industry, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, advanced SMT, wedge bonding and a broader range of expendable tools to its core ball bonding products. Combined with its extensive expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation semiconductor and LED devices. (www.kns.com)