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Computrol Triples Its Medium Volume Inspection Capability with Three Koh Young SPI Systems

Jun 13, 2016

SMT Operator Richard Aggrey operating the new KY-8030-3s.

SMT Operator Richard Aggrey operating the new KY-8030-3s.

Computrol, Inc., a world-class provider of mid- to low-volume, high-mix electronic manufacturing services to OEMs, has purchased three KY-8030-3 in-line, fully automated SPI systems from Koh Young Technology.

Computrol’s medium-volume customers will benefit from the KY-8030’s rugged dependability and all of the benefits of in-line 3D SPI. The KY-8030-3 uses patented Koh Young shadow-free inspection technology and software to deliver 100 percent 3D inspection of solder paste. It delivers superior value and offers true patented 3D volume measurement. Additionally, the following features will help Computrol continue to offer world-class manufacturing to its customers:

  • No false calls – no escapes – no shadow problems
  • Highest accuracy and repeatability

  • No PCB color sensitivity

  • Solder paste printing optimization - at its best

  • Accurate, powerful SPC tool package

Computrol installed two of the systems at its Meridian, ID plant and one at its Orem, UT facility. “We purchased this system to better meet the high quality demands of our customers,” said James Spencer, Engineering Manager for Computrol.


Computrol, Inc., with manufacturing facilities in Meridian, Idaho and Orem, Utah, is a leading national provider of high-quality, low-volume electronics manufacturing capabilities, serving military, medical, aerospace, broadcast and general industry customers. For more information about Computrol, Inc., visit www.computrol.com.

Koh Young Technology specializes in the design and manufacturing of 3D measurement and inspection

equipment for the global circuit board assembly and semiconductor markets. Direct sales and support centers are located in the United States, Germany, Japan, Singapore, China (Shenzhen) and Korea. For more information about the company, visit www.kohyoung.com.

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