SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces PF606-P116 / PF606-P128 / PF606-XP LED Die Bonding Solder Pastes

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces PF606-P116 / PF606-P128 / PF606-XP LED Die Bonding Solder Pastes

Jun 05, 2016

SHENMAO PF606-P116 Halogen Free Water Soluble LED Die Bonding Solder Pastes are made locally in the USA and with the same quality in 8 other worldwide locations. SHENMAO PF606-P116 Low Viscosity (easy to apply – Long Stencil Life), High Tackiness (slump resistant), consistent printability with Superior Wetting Characteristics for LED Die Bonding, BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 seconds over 220ºC in Air or Nitrogen) create Highly Reliable and Lowest Void (Smaller and Fewer Voids) Solder Joints with Optimum Maximized Quality through Highest Productivity.

SHENMAO PF606-P128 Halogen Free Water Soluble LED Die Bonding Solder Paste, available for dispensing in Syringes in Medium Viscosity, exhibits excellent Slump Characteristics, consistent dispense ability, stable tackiness force with great Transfer Rate and excellent wash ability, it is available in T3 to T8 Powder Size.

SHENMAO PF606-XP Halogen Free Water Soluble Low Viscosity LED BGA and Micro BGA Ball Dipping Solder Paste has great Slump Characteristics and stable Tackiness Force exhibiting extremely uniform Dipping Volume for consistent High Quality Joints.

As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux and PV Ribbon.

For more information, please contact: SHENMAO America, Inc. www.shenmao.com Tel: 408-943-1755 e-mail: usa@shenmao.com Register: https://www.ectc.net/registration/index.cfm

Nov 28, 2017 -

SHENMAO Introduces New Generation Zero Halogen Lead-Free Solder Paste PF606-P245 to solve HoP issues and Improve ICT Testability, Sponsors MEPTEC SEMICONDUCTOR PACKAGING SYMPOSIUM November 30, 2017, E

Nov 28, 2017 -

SHENMAO Introduces New Generation Zero Halogen Lead-Free Solder Paste PF606-P245 to solve HoP issues and Improve ICT Testability

Nov 24, 2017 -

SHENMAO America, Inc. exhibits at local SMTA Exhibition at Bestronics, San Jose, CA Facility on November 29 - Introduces 2 new Solder paste formulations.

Sep 12, 2017 -

SHENMAO Introduces New Generation Lead-Free Solder Paste PF606-P140 To Solve HoP Issues and Improve ICT Testability at SMTAI Exhibition

Jul 09, 2017 -

SHENMAO Exhibits at SEMICON WEST July 11-13, 2017 Booth # 5716 Introduces New Tacky Flux SMF-WC52 for Flip Chip Technology

Jul 06, 2017 -

SHENMAO Exhibits at SEMICON WEST July 11-13, 2017 Booth # 5716 Introduces New Low Residue Liquid Flux SMF-B51

Jun 25, 2017 -

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

May 03, 2017 -

SHENMAO America, Inc. Exhibits Monday, May 8 Booth # 7

Mar 20, 2017 -

SHENMAO America, Inc. Introduces Omega Aleaciones S.A. de C.V. the Exclusive Mexico Distributor of SHENMAO Solder Paste & Flux

Feb 01, 2017 -

SHENMAO America, Inc. Sponsors the SMTA Pan Pacific Microelectronics Symposium, February 6-9, 2017

25 more news from Shenmao Technology Inc. »

Jan 18, 2018 -

MIRTEC Europe Celebrates 10 Years of Consistent Inspection Innovation

Jan 18, 2018 -

Inovar, Inc. Celebrates 20 years as a Leading Electronic Manufacturing Company Milestone recommits the company to its purpose and core values

Jan 18, 2018 -

Saelig Introduces RSA5000 3.2/6.5GHz Real-Time Spectrum Analyzers

Jan 18, 2018 -

Cobar Solder Products Inc. at IPC APEX EXPO 2018

Jan 17, 2018 -

Inovaxe to Showcase Its Intelligent Ultra-Lean Total Material Handling and Storage Solution at SMTA Space Coast Expo

Jan 17, 2018 -

Schleuniger Introduces CableCoiler 1450 Single Pan Coiling System

Jan 17, 2018 -

Schleuniger Introduces CableCoiler 1450 Single Pan Coiling System

Jan 17, 2018 -

Schleuniger Introduces CableCoiler 1450 Single Pan Coiling System

Jan 17, 2018 -

CalcuQuote Exhibits at IPC APEX Expo 2018

Jan 17, 2018 -

Data I/O Expands Market Leading LumenX Platform to Support Universal Flash Storage (UFS)

See electronics manufacturing industry news »

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces PF606-P116 / PF606-P128 / PF606-XP LED Die Bonding Solder Pastes news release has been viewed 663 times

  • SMTnet
  • »
  • Industry News
  • »
  • SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces PF606-P116 / PF606-P128 / PF606-XP LED Die Bonding Solder Pastes
Software for SMT

pcb components vacuum pick up