SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Shenmao Technology Inc.


SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces PF606-P116 / PF606-P128 / PF606-XP LED Die Bonding Solder Pastes

Jun 05, 2016

SHENMAO PF606-P116 Halogen Free Water Soluble LED Die Bonding Solder Pastes are made locally in the USA and with the same quality in 8 other worldwide locations. SHENMAO PF606-P116 Low Viscosity (easy to apply – Long Stencil Life), High Tackiness (slump resistant), consistent printability with Superior Wetting Characteristics for LED Die Bonding, BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 seconds over 220ºC in Air or Nitrogen) create Highly Reliable and Lowest Void (Smaller and Fewer Voids) Solder Joints with Optimum Maximized Quality through Highest Productivity.

SHENMAO PF606-P128 Halogen Free Water Soluble LED Die Bonding Solder Paste, available for dispensing in Syringes in Medium Viscosity, exhibits excellent Slump Characteristics, consistent dispense ability, stable tackiness force with great Transfer Rate and excellent wash ability, it is available in T3 to T8 Powder Size.

SHENMAO PF606-XP Halogen Free Water Soluble Low Viscosity LED BGA and Micro BGA Ball Dipping Solder Paste has great Slump Characteristics and stable Tackiness Force exhibiting extremely uniform Dipping Volume for consistent High Quality Joints.

As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux and PV Ribbon.

For more information, please contact: SHENMAO America, Inc. www.shenmao.com Tel: 408-943-1755 e-mail: usa@shenmao.com Register: https://www.ectc.net/registration/index.cfm

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More News from Shenmao Technology Inc.

Oct 09, 2016 -

SHENMAO Technology presents a Poster at the 13 th. IWLPC At DoubleTree Airport Hotel by Hilton, San Jose, CA, USA

Oct 09, 2016 -

SHENMAO America, Inc. Exhibits October 18-19 at IWLPC Introduces Semiconductor Packaging Materials

Sep 26, 2016 -

SHENMAO Introduces Room Temperature Storable RT Series Solder Paste at SMTAI Booth # 800 September 27-28, 2016

Sep 13, 2016 -

SHENMAO Exhibits at SMTA International at Donald E Stephens Convention Center, Rosemont, Il September 27-28, 2016 Booth # 800

Aug 23, 2016 -

SHENMAO Exhibits at SEMICON TAIWAN on September 7-9, 2016 Booth # J2922 Featuring BGA Solder Spheres and Bumping Paste

Jul 11, 2016 -

SHENMAO Introduces SMF-WB02 / SMF-WB51 Water Soluble Flux At Semicon West 2016 Booth # 6467 in San Francisco

Jul 07, 2016 -

SHENMAO Introduces BGA and Micro BGA Bumping Solder Paste At Semicon West 2016 Booth # 6467 in San Francisco

Jul 02, 2016 -

SHENMAO Exhibits at SEMICON WEST July 12-14, 2016 Booth # 6467 Introduces BGA and Micro BGA Solder Spheres

Jun 05, 2016 -

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces PF606-P116 / PF606-P128 / PF606-XP LED Die Bonding Solder Pastes

May 31, 2016 -

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces Laser Soldering Paste

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SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces PF606-P116 / PF606-P128 / PF606-XP LED Die Bonding Solder Pastes news release has been viewed 166 times

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