SHENMAO PF606-P116 Halogen Free Water Soluble LED Die Bonding Solder Pastes are made locally in the USA and with the same quality in 8 other worldwide locations. SHENMAO PF606-P116 Low Viscosity (easy to apply – Long Stencil Life), High Tackiness (slump resistant), consistent printability with Superior Wetting Characteristics for LED Die Bonding, BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 seconds over 220ºC in Air or Nitrogen) create Highly Reliable and Lowest Void (Smaller and Fewer Voids) Solder Joints with Optimum Maximized Quality through Highest Productivity.
SHENMAO PF606-P128 Halogen Free Water Soluble LED Die Bonding Solder Paste, available for dispensing in Syringes in Medium Viscosity, exhibits excellent Slump Characteristics, consistent dispense ability, stable tackiness force with great Transfer Rate and excellent wash ability, it is available in T3 to T8 Powder Size.
SHENMAO PF606-XP Halogen Free Water Soluble Low Viscosity LED BGA and Micro BGA Ball Dipping Solder Paste has great Slump Characteristics and stable Tackiness Force exhibiting extremely uniform Dipping Volume for consistent High Quality Joints.
As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux and PV Ribbon.
For more information, please contact: SHENMAO America, Inc. www.shenmao.com Tel: 408-943-1755 e-mail: email@example.com Register: https://www.ectc.net/registration/index.cfm