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  • SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces BGA and Micro BGA Solder Spheres

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces BGA and Micro BGA Solder Spheres

May 16, 2016

SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.

SHENMAO High Drop-Resistance Alloy PF902-S (SAC0307X) greatly increases reliability and performance of Portable Electronic Devices drop test.


As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux and PV Ribbon.

Nov 28, 2017 -

SHENMAO Introduces New Generation Zero Halogen Lead-Free Solder Paste PF606-P245 to solve HoP issues and Improve ICT Testability, Sponsors MEPTEC SEMICONDUCTOR PACKAGING SYMPOSIUM November 30, 2017, E

Nov 28, 2017 -

SHENMAO Introduces New Generation Zero Halogen Lead-Free Solder Paste PF606-P245 to solve HoP issues and Improve ICT Testability

Nov 24, 2017 -

SHENMAO America, Inc. exhibits at local SMTA Exhibition at Bestronics, San Jose, CA Facility on November 29 - Introduces 2 new Solder paste formulations.

Sep 12, 2017 -

SHENMAO Introduces New Generation Lead-Free Solder Paste PF606-P140 To Solve HoP Issues and Improve ICT Testability at SMTAI Exhibition

Jul 09, 2017 -

SHENMAO Exhibits at SEMICON WEST July 11-13, 2017 Booth # 5716 Introduces New Tacky Flux SMF-WC52 for Flip Chip Technology

Jul 06, 2017 -

SHENMAO Exhibits at SEMICON WEST July 11-13, 2017 Booth # 5716 Introduces New Low Residue Liquid Flux SMF-B51

Jun 25, 2017 -

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

May 03, 2017 -

SHENMAO America, Inc. Exhibits Monday, May 8 Booth # 7

Mar 20, 2017 -

SHENMAO America, Inc. Introduces Omega Aleaciones S.A. de C.V. the Exclusive Mexico Distributor of SHENMAO Solder Paste & Flux

Feb 01, 2017 -

SHENMAO America, Inc. Sponsors the SMTA Pan Pacific Microelectronics Symposium, February 6-9, 2017

25 more news from Shenmao Technology Inc. »

Jan 17, 2018 -

Data I/O Expands Market Leading LumenX Platform to Support Universal Flash Storage (UFS)

Jan 16, 2018 -

Female Leaders in Tech, Everywhere rising high as mentor Michelle Ogihara joins as Ambassador for the U.S.

Jan 16, 2018 -

Preview for IPC Apex 2018 San Diego, booth # 3007 JTAG Visualizer Update Adds Features for Faster Debug Assess PCB assembly fault coverage and find board build errors quicker

Jan 16, 2018 -

Seika’s Michelle Ogihara Joins FLITE as Ambassador for the U.S.

Jan 16, 2018 -

Libra Industries Achieves NIST SP 800-171 Compliance

Jan 16, 2018 -

Vision Engineering’s FREE Electronics Academy Webinar Series to Broadcast: Eliminate Printed Circuit Board Problems and Failure Modes

Jan 16, 2018 -

Datest and VJ Technologies Hosting Digital X-ray Inspection Services Open House – January 23, 2018

Jan 16, 2018 -

Press Release: YINCAE’S New Reflowable Underfill Material: SMT 160

Jan 16, 2018 -

Gen3 Systems announces product line up for Southern Manufacturing

Jan 16, 2018 -

Press Release: Low Temperature Reflowable Underfill Material: SMT 160L

See electronics manufacturing industry news »

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces BGA and Micro BGA Solder Spheres news release has been viewed 481 times

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  • SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces BGA and Micro BGA Solder Spheres
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