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  • SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces BGA and Micro BGA Solder Spheres

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces BGA and Micro BGA Solder Spheres

May 16, 2016

SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.

SHENMAO High Drop-Resistance Alloy PF902-S (SAC0307X) greatly increases reliability and performance of Portable Electronic Devices drop test.


As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux and PV Ribbon.

May 20, 2018 -

SHENMAO America to Participate in the eSMART Factory Conference

May 16, 2018 -

SHENMAO America to Show New Solder Alloy with High Thermal & Impact Reliability at SMTA Michigan Expo

Apr 25, 2018 -

SHENMAO Technology to Exhibit New Solder Alloy with High Thermal & Impact Reliability at SEMICON Southeast Asia

Apr 05, 2018 -

SHENMAO Technology will attend AutoTronics Taipei 2018

Jan 24, 2018 -

SHENMAO America to Solve Solder Paste Problems at APEX

Nov 28, 2017 -

SHENMAO Introduces New Generation Zero Halogen Lead-Free Solder Paste PF606-P245 to solve HoP issues and Improve ICT Testability, Sponsors MEPTEC SEMICONDUCTOR PACKAGING SYMPOSIUM November 30, 2017, E

Nov 28, 2017 -

SHENMAO Introduces New Generation Zero Halogen Lead-Free Solder Paste PF606-P245 to solve HoP issues and Improve ICT Testability

Nov 24, 2017 -

SHENMAO America, Inc. exhibits at local SMTA Exhibition at Bestronics, San Jose, CA Facility on November 29 - Introduces 2 new Solder paste formulations.

Sep 12, 2017 -

SHENMAO Introduces New Generation Lead-Free Solder Paste PF606-P140 To Solve HoP Issues and Improve ICT Testability at SMTAI Exhibition

Jul 09, 2017 -

SHENMAO Exhibits at SEMICON WEST July 11-13, 2017 Booth # 5716 Introduces New Tacky Flux SMF-WC52 for Flip Chip Technology

30 more news from Shenmao Technology Inc. »

May 25, 2018 -

Saelig Introduces LoRa/FSK Smart Modem Transceiver For Long Range Control

May 25, 2018 -

Allchips won 10 million of A Round Investment in January 2018

May 24, 2018 -

DOVER CORPORATION SELECTS OK INTERNATIONAL – CYPRESS AS AN INAUGURAL WINNER OF THE DOVER SAFETY EXCELLENCE AWARD

May 24, 2018 -

DOVER CORPORATION SELECTS OK INTERNATIONAL – CYPRESS AS AN INAUGURAL WINNER OF THE DOVER SAFETY EXCELLENCE AWARD

May 24, 2018 -

CyberOptics Demonstrates Advanced Airborne Particle Sensing Technology at SEMICON West

May 23, 2018 -

Koh Young, the 3D Inspection Market Leader, Reports Strong Quarterly Results Again

May 22, 2018 -

Metcal Is Reinventing Hand Soldering – Learn More at the SMTA Upper Midwest Expo

May 22, 2018 -

Europlacer to Show Full Assembly Line Products & Solutions at SMT Nuremberg.

May 22, 2018 -

IPC Releases Additional Test Coupons for the IPC-2221B Gerber Coupon Generator Test Coupons provide structural integrity verification based on current printed board design technology

May 22, 2018 -

Specialized Coating Services Hosts Successful Open House for New Billerica Facility

See electronics manufacturing industry news »

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces BGA and Micro BGA Solder Spheres news release has been viewed 622 times

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  • SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces BGA and Micro BGA Solder Spheres
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