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  • SMTA China Presents Nine Best-Paper / Oustanding Paper / Best Presentation Awards and Two Best Exhibit Awards at SMTA China East 2016 Conference / Nepcon China 2016

SMTA China Presents Nine Best-Paper / Oustanding Paper / Best Presentation Awards and Two Best Exhibit Awards at SMTA China East 2016 Conference / Nepcon China 2016

May 09, 2016

SMTA China announces that it presented awards for Nine papers at the SMTA China East 2016 Conference Award Presentation Ceremony, held on Tuesday, April 26, 2016 at Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.  

Quanta Computer Co., Ltd.’s Colin Wang was awarded The Best Paper of Technology Conference One for the paper titled “System Level Thermal Cycling and Shock Reliability Performance of Low Temperature Soldering”   

Vitronics Soltec Corp.’s Karheong Khoh was awarded The Outstanding Paper of Technology Conference One for the paper titled “Design Improvements for Selective Soldering Assemblies” 

 Akrometrix, LLC.’s Heetiong Poh was awarded The Best Paper of Technology Conference Two for the paper titled “Quantifying HnP Defects By Measuring The Gap Between BGA and PCB During Reflow” 

 Kyzen Corporation.’s Daniel Gao was awarded The Outstanding Paper of Technology Conference Two for the paper titled “Cleanliness Makes A Difference When Miniaturization Kicks In”   

Toby Jiang, from Mentor Graphics (Shanghai) Electronic Co., Ltd. received the award for The Best Presentation of Technology Conference One for the presentation titled “Smart Manufacturing Systems---The Core Link of The Industry 4.0”  

Heetiong Poh, from Akrometrix, LLC received the award for The Best Presentation of Technology Conference Two for the presentation titled “Quantifying HnP Defects By Measuring The Gap Between BGA and PCB During Reflow”  

Jiaqiang Huang, from Shenzhen City TongFang Electronic New-material Co.,Ltd. received the award for The Best Presentation of Vendor Conference One for the presentation titled “The Reliability of LED Packaging With Low-Temperature SnBi Solder Paste”  

Paul Wood, from OK Internatiaonl, received the award for The Best Presentation of Vendor Conference Two for the presentation titled “CBGA Package Cleaning Challenges A New Site Cleaning and Solder Ball Removal Method”  

Ji Xu,from ASM Assembly Systems Ltd.received the award for The Best Presentation of Vendor Conference Three for the presentation titled “The First Self-Learning Expert System for SMT Production”  

CyberOptics, received the award for The Best Emerging Exhibit of the Year 2016 China East with the product of “Top&Bottom Side AOI System” and Model of “QX200i”   

ITW EAE, a division of Illinois Tool Works, Inc, received the award for The Best Exhibit Technology of the Year 2016 China East with the product of “Reflow Soldering Equipment” and Model of “Vitronics Soltec Centurion”  

For more information about the SMTA China, contact Ms. Peggy Chen at +86-21-5609-3010; E-mail: peggychen@smta.org.cn   
                 
   
                      
 

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