SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Surface Mount Technology Association (SMTA)


SMTA/CALCE Announce Program for Symposium on Counterfeit Parts and Materials

May 05, 2016

The Surface Mount Technology Association (SMTA) and the Center for Advanced Life Cycle Engineering (CALCE) announce the preliminary technical program for the Symposium on Counterfeit Parts and Materials this June 28-30, 2016 in College Park, Maryland.

The symposium will commence on Tuesday, June 28 with a keynote presentation by Henry Livingston, BAE Systems, titled “Counterfeit Electronic Parts - Observations and Insights from a US Defense Industry Perspective.” Sessions on industry standards, trends, and future technologies will feature presentations from SAE, Mentor Graphics, Naval Surface Warfare Center, and Northrop Grumman among others.

Thomas Sharpe, SMT Corporation, will open the second day of the symposium with his keynote presentation “Getting Ready for the Coming Deluge of Complex Cloned Devices.” The subsequent sessions will focus on defining counterfeits, independent component distribution, the latest technology challenges, and views across the supply chain. Presentations are scheduled from companies including EMBRAER S.A., TTI, US Department of Justice, and  more.

Thursday, June 30, is dedicated entirely to workshops including a full day course on the Implementation Process of SAE 6171. Half day courses will cover Counterfeit Detection Inspection Techniques and also Use of Component Documentation and Supply Chain for Counterfeit Avoidance.

The information presented at this symposium is valuable to quality and reliability managers, supply chain managers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies. For more information visit: http://www.smta.org/counterfeit/

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

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