SMT, PCB Electronics Industry News

IPC Issues Call for Participation for IPC APEX EXPO 2017

Apr 29, 2016

IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2017 to be held at the San Diego Convention Center. Professional development courses will take place February 12, 13 and 16, 2017 and the technical conference will take place February 14–16, 2017.

The industry’s premier conference and exhibition for the electronic interconnection industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. Staff from companies such as Nokia, Ericsson, Indium, Flextronics, Intel and MacDermid have presented papers at past technical conference sessions at IPC APEX EXPO. To recognize exceptional achievement, awards will be presented for “Best Paper.”

Expert papers and presentations are being sought on design, materials, assembly, processes, test, reliability and equipment in the following areas:

  • 3D Printing in Electronics Manufacturing

  • Automation in Electronics Manufacturing

  • Adhesives

  • Advanced Technology

  • Area Array/Flip Chip/0201 Metric

  • Assembly and Rework Processes

  • BGA/CSP Packaging

  • Black Pad and Other Board Related Defect Issues

  • BTC/QFN/LGA Components

  • Business & Supply Chain Issues

  • Cleaning

  • Conformal Coatings

  • Corrosion

  • Counterfeit Electronics

  • Design

  • Electromigration

  • Electronics Manufacturing Services

  • Embedded Passive & Active Devices

  • Environmental Compliance

  • Graphene in Electronics Manufacturing

  • Lean Six Sigma

  • LED Manufacturing

  • Failure Analysis

  • Flexible Circuitry

  • HDI Technologies

  • Head-on-Pillow

  • Board and Component Warpage

  • High Speed, High Frequency & Signal

  • Industry 4.0

  • Integrity

  • Lead-Free Fabrication, Assembly & Reliability

  • Miniaturization Nanotechnology Optoelectronics

  • Packaging & Components

  • PCB Fabrication

  • PCB and Component Storage & Handling Performance

  • Quality & Reliability

  • Photovoltaics

  • PoP (Package-on-Package)

  • Printed Electronics

  • Reshoring

  • RFID Circuitry

  • Robotics

  • Soldering

  • Surface Finishes

  • Test, Inspection & AOI

  • Tin Whiskers

  • 2.5-D/3-D Component Packaging

  • Underfills

  • Via Plugging & Other Protection

  • Wearables

A 200-400 word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results. In addition, course proposals are solicited from individuals interested in presenting half-day or full-day professional development courses on design, lead-free technologies, manufacturing processes, process improvement, materials, test and reliability.

Technical conference paper abstracts are due June 17, 2016 and course proposals are due August 5, 2016. To submit an abstract or course proposal, visit www.IPCAPEXEXPO.org/CFP.


IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
 

Nov 13, 2017 -

New Software Toolkit, CFX Messaging Library Expedites Connected Factory Exchange Implementation

Nov 13, 2017 -

Ventec International Group Receives IPC-4101 Qualified Products Listing Certification

Nov 07, 2017 -

IPC Releases G Revisions of Two Widely Used Standards, IPC-A-610 and IPC J-STD-001

Oct 30, 2017 -

IPC Pulse Survey Reveals Bullish Outlook for Equipment and PCB Manufacturers

Oct 26, 2017 -

IPC Hand Soldering Competition Winner Crowned at ELECTROSUB 2017 in Budapest

Oct 18, 2017 -

IPC Hand Soldering Competition Winner Crowned at IFTEC in Paris

Oct 17, 2017 -

PCB Prototype Sales Trends Often Diverge from PCB Market Trends According to New IPC Report

Oct 17, 2017 -

IPC APEX EXPO 2018 Educational Programs Highlight Technology’s Accelerating Speed of Change Registration Now Open, Show Floor More than 95% Sold

Oct 11, 2017 -

Nate Carson Joins IPC as New Director of Business Development

Oct 05, 2017 -

IPC Releases 2017 Quality Benchmark Study for Electronics Assembly

863 more news from Association Connecting Electronics Industries (IPC) »

Nov 17, 2017 -

Altus on the Road to Digital Factory of the Future

Nov 17, 2017 -

MicroCare Wins Prestigious Global Technology Award at Productronica 2017

Nov 17, 2017 -

Mycronic and Aegis renew partnership – FactoryLogix software to be embedded with MY700

Nov 16, 2017 -

Europlacer Unveils its New Atom Platform.

Nov 16, 2017 -

Libra Industries installs another 3D post reflow AOI system at its Dallas facility

Nov 16, 2017 -

STI Participates in Manufacturing Day

Nov 16, 2017 -

ZESTRON to Exhibit at SMTA Silicon Valley

Nov 16, 2017 -

Comet Group Receives 2017 Global Technology Award for Test Services at Lab One

Nov 15, 2017 -

WKK Distribution Honored as Best Asian Distributor

Nov 15, 2017 -

KYZEN, the Leader in Cleaning Innovation, Receives Its 60th Industry Award

See electronics manufacturing industry news »

IPC Issues Call for Participation for IPC APEX EXPO 2017 news release has been viewed 553 times

 Reflow System

SMT Equipment Service