IPC Issues Call for Participation for IPC APEX EXPO 2017

Apr 29, 2016

IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2017 to be held at the San Diego Convention Center. Professional development courses will take place February 12, 13 and 16, 2017 and the technical conference will take place February 14–16, 2017.

The industry’s premier conference and exhibition for the electronic interconnection industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. Staff from companies such as Nokia, Ericsson, Indium, Flextronics, Intel and MacDermid have presented papers at past technical conference sessions at IPC APEX EXPO. To recognize exceptional achievement, awards will be presented for “Best Paper.”

Expert papers and presentations are being sought on design, materials, assembly, processes, test, reliability and equipment in the following areas:

  • 3D Printing in Electronics Manufacturing

  • Automation in Electronics Manufacturing

  • Adhesives

  • Advanced Technology

  • Area Array/Flip Chip/0201 Metric

  • Assembly and Rework Processes

  • BGA/CSP Packaging

  • Black Pad and Other Board Related Defect Issues

  • BTC/QFN/LGA Components

  • Business & Supply Chain Issues

  • Cleaning

  • Conformal Coatings

  • Corrosion

  • Counterfeit Electronics

  • Design

  • Electromigration

  • Electronics Manufacturing Services

  • Embedded Passive & Active Devices

  • Environmental Compliance

  • Graphene in Electronics Manufacturing

  • Lean Six Sigma

  • LED Manufacturing

  • Failure Analysis

  • Flexible Circuitry

  • HDI Technologies

  • Head-on-Pillow

  • Board and Component Warpage

  • High Speed, High Frequency & Signal

  • Industry 4.0

  • Integrity

  • Lead-Free Fabrication, Assembly & Reliability

  • Miniaturization Nanotechnology Optoelectronics

  • Packaging & Components

  • PCB Fabrication

  • PCB and Component Storage & Handling Performance

  • Quality & Reliability

  • Photovoltaics

  • PoP (Package-on-Package)

  • Printed Electronics

  • Reshoring

  • RFID Circuitry

  • Robotics

  • Soldering

  • Surface Finishes

  • Test, Inspection & AOI

  • Tin Whiskers

  • 2.5-D/3-D Component Packaging

  • Underfills

  • Via Plugging & Other Protection

  • Wearables

A 200-400 word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results. In addition, course proposals are solicited from individuals interested in presenting half-day or full-day professional development courses on design, lead-free technologies, manufacturing processes, process improvement, materials, test and reliability.

Technical conference paper abstracts are due June 17, 2016 and course proposals are due August 5, 2016. To submit an abstract or course proposal, visit www.IPCAPEXEXPO.org/CFP.

IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

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