SMT, PCB Electronics Industry News

YINCAE Advanced Materials at IMAPS NE Booth # 101

Apr 25, 2016

IMAPS New England 2016 is in 1 week

VISIT YINCAE BOOTH # 101

Join Dr. Yin’s Presentation May, 3rd at 1pm

(Albany, NY) 4/25/2016 – IMAPS New England is 1 week away! Dr. Wusheng Yin, the president of YINCAE Advanced Materials LLC, is going to be speaking at the upcoming 43rd Symposium & Expo. IMAPS 2016 will take place May 3rd. YINCAE hopes you will stop by our booth # 101 to learn more about YINCAE and the innovative products we have to offer. It will be held at The Holiday Inn Conference Center, in Boxborough, MA.

Dr. Yin will be presenting his white paper, “Room Temperature Fast Flow reworkable Underfill for LGA.”  This paper will focus on the miniaturization of electronic devise and how Land Grid Array (LGA) or QFN has been widely used in these electronic devices. This paper will discuss how a room temperature fast flow reworkable underfill will help improve the quality control and reliability issue of said devices. The presentation will be Tuesday, May 3rd at 1pm.

YINCAE Advanced Materials, LLC hopes that you will join us at the conference to learn about YINCAE and the products that we have to offer. YINCAE has exclusive products that no other company has developed. YINCAE hopes to see you there at the conference. Please visit us at our booth # 101!

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

* * * * * * * * * *

Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

 ###

The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

Aug 15, 2017 -

SMTA International 2017 – 1 month away

Aug 15, 2017 -

SMTA INTERNATIONAL is 1 MONTH AWAY! VISIT YINCAE BOOTH #329 September 19 & 20

Aug 15, 2017 -

High Reliability & High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesive

Aug 08, 2017 -

High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste

Aug 08, 2017 -

High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste

Jul 25, 2017 -

YINCAE TO EXHIBIT AT SMTAI 2017

Jun 20, 2017 -

SEMICON West is 1 Month Away, Visit Yincae at Booth 5248

Jun 19, 2017 -

DA 90 Low Temperature Die Attach Adhesive Series Materials

Jun 13, 2017 -

SMT 158UL Highly Filled Room Temperature Underfill

Jun 06, 2017 -

SMT 88UL Super-Fast Flow Room Temperature Underfill

23 more news from YINCAE Advanced Materials, LLC. »

Aug 19, 2017 -

See Latest Dispense Technology Demonstrations From GPD Global at NEPCON 2017

Aug 17, 2017 -

ZESTRON Americas Announces New Regional Sales Manager

Aug 17, 2017 -

SEHO Soldering Expert to Discuss Resource & Cost Efficient Wave Soldering at SMTAI

Aug 17, 2017 -

Libra Industries Announces Two 20-Year Service Awards in Q2 2017

Aug 17, 2017 -

Cirtronics Installs High-Performance X-ray Inspection Solution

Aug 17, 2017 -

Essemtec to Show New All-in-One Jetting / Placement System at SMTAI

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 17, 2017 -

What is SMT and where to by SMT spare parts

Aug 16, 2017 -

ViTrox and KIC Establish Cooperation and Connectivity

Aug 16, 2017 -

Inovaxe Is Making Storage SMARTER – Visit Booth #915 at SMTAI

See electronics manufacturing industry news »

YINCAE Advanced Materials at IMAPS NE Booth # 101 news release has been viewed 536 times

conformal coating software

PCB Rework / Repair Services