Wire Bonding is the most common interconnect technology. However, it can be challenging and has a major effect on product quality. The purpose of Wire Bonding is to create the electrical interconnection between the IC chip and the package. Decisions need to be made on the type of wire bonding technology, wire size, bonding method, wire material, etc. in order to get the most reliable bonds. This Infographic provides some factors that need to be considered when designing your particular packaging application.
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