SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Microtek, Inc.

5 Considerations for Wire Bonding [Infographic]

Apr 20, 2016

Wire Bonding is the most common interconnect technology. However, it can be challenging and has a major effect on product quality. The purpose of Wire Bonding is to create the electrical interconnection between the IC chip and the package. Decisions need to be made on the type of wire bonding technology, wire size, bonding method, wire material, etc. in order to get the most reliable bonds. This Infographic provides some factors that need to be considered when designing your particular packaging application.

As the technical bridge from R&D through manufacturing, we help our clients turn their IP into a commercially viable product. Please contact us for more information or to discuss your project requirements further.

You must be a registered user to talk back to us.

More News from Microtek, Inc.

Oct 06, 2016 -

Microtek Hosts National Manufacturing Day Event

Jul 25, 2016 -

Microtek Adds FINEPLACER® Lambda Die Bonder to New Facility

Dec 09, 2015 -

New Startup Combines Therapeutics and Microelectronics to Deliver Highly Innovative Products and Solutions

5 Considerations for Wire Bonding [Infographic] news release has been viewed 20 times

Metcal soldering rework

 Reflow System