SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016

Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016

Apr 07, 2016

Finetech/Martin will showcase three new dispense products and a new version of the Mini-Oven BGA/CSP reballing unit in Booth #1259 at the upcoming IPC APEX Conference scheduled for March 15-17, 2016 at the Las Vegas Convention Center.

The Dotliner 07 is an automatic, solder paste and SMT adhesive dispenser capable of dispensing 100 micron dots repeatably. Regardless of whether liquid or paste-like materials are dispensed, no retrofitting of the device is required.  The Dotliner 07 features easy dispense wizard software, closed-loop pressure and temperature control in a small footprint and table-top design.

There will be two new manual dispensers on display that offer a compact package and user display. The Clever Dispense 06 has high speed valves that enable the dispenser to accurately and reliably produce less than 200µm dots and lines. Clever Dispense 06 handles a wide range of viscosities (alcohols to silicones). The Smart Dispense 06 provides accuracy and repeatability at a superior value with a closed-loop pressure control. Nozzle heating and vacuum retract are available as optional features.

The MiniOven 05 is the latest version of this popular reballing and prebumping system, with technical innovations that result in increased performance and operating simplicity. This stand-alone unit reballs micro-BGAs, BGAs and BGA Sockets and prebumps QFNs and leadless devices. Updated firmware provides enhanced process capability and temperature stability, while a new external thermocouple allows closed loop profiling.

Also on display in the booth, the Fineplacer® Core system for advanced rework applications and the Martin 10.6 HXV for large board rework.


Finetech (and subsidiary Martin) offer a wide range of rework, micro-dispensing and bonding equipment solutions. The companies serve customers within the medical, communications, computer, semiconductor, photonics, military, aerospace, and automotive industries, as well as leading universities and research centers. All equipment is design and manufactured in Germany and the US Sales and Customer Support centers are located in Manchester, New Hampshire and Gilbert, Arizona.To learn more about Finetech rework and bonding solutions, please visit www.finetechusa.com.

For Martin rework and dispensing products, visit www.martin-smt.de.

Nov 27, 2013 -

Martin Streamlines and Simplifies Rework with New Process Shuttle

Nov 08, 2013 -

Finetech Unveils High Force ACF Bonder

May 28, 2013 -

Al Cabral Joins Finetech as Regional Sales Manager

Mar 11, 2013 -

Donated Finetech Die Bonder Installed at Pennsylvania State University

Jan 16, 2013 -

Finetech to Exhibit the Ideal Blend of Performance and Cost Rework Technology at the 2013 IPC APEX EXPO

Jan 04, 2013 -

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Oct 03, 2012 -

The Best in Rework Technology – Finetech to Exhibit FINEPLACER® Core Rework System at SMTA International

Sep 26, 2012 -

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

Sep 10, 2012 -

MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012

Sep 05, 2012 -

High-Accuracy R&D Die Bonder on Display at Finetech Booth #505 at IMAPS 2012 – San Diego

76 more news from Finetech »

Oct 17, 2017 -

Focused IR Rework Technology from PDR to be Displayed in the Tecnolab Booth at productronica – Hall A2, Booth 459

Oct 17, 2017 -

Monitor Your Cleaning Process with ANALYST Data Services – Visit KYZEN in Hall A4, Booth 314 at productronica

Oct 17, 2017 -

CyberOptics Demonstrates New MRS-Enabled AOI, SPI and CMM Solutions at productronica Germany

Oct 17, 2017 -

Scienscope Announces X-ray Lineup for productronica

Oct 17, 2017 -

Nordson Test & Inspection Announces Lineup for productronica

Oct 17, 2017 -

Vi TECHNOLOGY prepares for a busy productronica

Oct 17, 2017 -

Best Rated Cost, Flexibility & Technology – MIRTEC’s MV-6 OMNI 3D AOI System at productronica

Oct 17, 2017 -

Microtronic GmbH to Have a Strong Presence with Its Suppliers at productronica

Oct 17, 2017 -

BTU to Introduce New Pyramax Vacuum Refow Oven at productronica

Oct 17, 2017 -

Pickering Interfaces to Highlight New PXI and LXI Switching Solutions at the International Test Expo 2017 Preview for ITC – Ft. Worth, TX – October 21 - November 2

See electronics manufacturing industry news »

Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016 news release has been viewed 572 times

  • SMTnet
  • »
  • Industry News
  • »
  • Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016
TWEEZER-VAC ELITE Vacuum SMD Tweezer Kit