SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Vi TECHNOLOGY to Exhibit Leading Technology in 3 Booths at NEPCON Shanghai

Vi TECHNOLOGY to Exhibit Leading Technology in 3 Booths at NEPCON Shanghai

Apr 04, 2016

Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, will exhibit in WKK’s Booth # 1F40 as well as First Technology’s Booth # 1G50, and American Tec’s Booth #1H45 at the upcoming NEPCON Shanghai, scheduled to take place April 26-28, 2016 at the Shanghai World Expo Exhibition and Convention Center in China.

In WKK booth 1F40, Vi TECHNOLOGY will display PI and 5K3D Machines. The PI Series allows the easy implementation of Solder Paste Inspection in any PCBA line. These new generation systems are very intuitive to use, allowing non-experienced persons to get expected results. With reduced footprint, all models are fitting in modern assembly lines. PI Series is automatic, accurate and repeatable, meeting your advanced SPI requirements with unprecedented simplicity. The 5K3D inline AOI, based on its 2D AOI, features two laser cameras and one beam. The 3D sensor has 1 micron resolution.

American Tec will also exhibit Vi TECHNOLOGY equipment in their booth.

In the First Technology booth 1G50, you will find the 7K machine. The 7K Dual Lane Series offers large-board capabilities up to 21’’ x 11’’ for each of the two lanes. The multi-segment dual-lane conveyors respond to floor-space constraints as well as AOI productivity concerns to meet customer expectations regarding cost/quality optimization. The 7K DL Series benefits from all our latest innovations and also provides enhanced color viewing on the DefectViewer station to facilitate operator repair jobs. The system includes the latest Vi TECHNOLOGY's software suite and P-Series acquisition heads with the i-LITE lighting system. It offers the same hardware and software upgradeability as the 5K Series and is also compatible with the 3K platform, having P-Series optical heads. The 7K DL Series ensures accuracy, repeatability and a short cycle time.


Vi TECHNOLOGY is a global designer, manufacturer and supplier of a wide range of innovative inspection equipment and software solutions for PCB assembly. Vi TECHNOLOGY serves very demanding market segments including telecoms, consumer, computer, automotive, infrastructure, industrial and medical.For more information, visit www.vitechnology.com.

Jul 18, 2017 -

Vi TECHNOLOGY Makes a Big Presence at NEPCON South China with Inspection Solutions in Three Booths

Jul 09, 2017 -

Vi TECHNOLOGY Moves Into New Territories

Jun 07, 2017 -

Inspection Expert Jean-Marc Peallat to Present at the InnovationsForum – Mexico

May 17, 2017 -

Green Circuits Forges Ahead with Continuous Improvement Adopting Vi TECHNOLOGY ‘s Optical Inspection solutions

Apr 23, 2017 -

Vi TECHNOLOGY to Exhibit Full Inspection Solution at SMT/Hybrid/Packaging

Apr 11, 2017 -

A New Era in Process Control – Vi TECHNOLOGY at NEPCON China

Mar 15, 2017 -

MaCon Adds Vi TECHNOLOGY’s PI Series to Its Line Card in Argentina

Mar 01, 2017 -

Vi TECHNOLOGY held successful Open Days in Hungary

Feb 23, 2017 -

Vi TECHNOLOGY Will Discuss Innovative Process Improvement Software for Smart Factories at ENOVA STRASBOURG

Jan 29, 2017 -

Discover How Vi TECHNOLOGY Can Improve SMT Production Line Performance: Visit the Company at the 2017 Innovations Forum

51 more news from Vi TECHNOLOGY »

Jul 21, 2017 -

Epec Now Offering PCB Layout and Design Services

Jul 21, 2017 -

Help customer solve problems of 750L machine

Jul 19, 2017 -

Digicom Electronics Receives AS9100:2016 (RevD) Aerospace and ISO 9001:2015 Certifications

Jul 19, 2017 -

Conecsus Presents SMT Metals Waste Recycling Solutions at SMTAI 2017

Jul 19, 2017 -

New Metcal HTD Tips & Hand-piece Increase Throughput and Save Money

Jul 19, 2017 -

Altus Supports Bespoke Desktop Robots for Automated Soldering, from ATN Germany

Jul 19, 2017 -

STI Acquires Fischerscope X-ray XDAL 237

Jul 19, 2017 -

COT Reduces Prices on SMT Nozzles & Consumables

Jul 19, 2017 -

Cogiscan Partners with iBASEt for Automated Electronics Assembly

Jul 19, 2017 -

International Wafer-Level Packaging Conference (IWLPC) Program Announced and Registration Now Open

See electronics manufacturing industry news »

Vi TECHNOLOGY to Exhibit Leading Technology in 3 Booths at NEPCON Shanghai news release has been viewed 412 times

  • SMTnet
  • »
  • Industry News
  • »
  • Vi TECHNOLOGY to Exhibit Leading Technology in 3 Booths at NEPCON Shanghai
Selective Solder Wetted Nozzles

PCB Buffers