SEHO Systems GmbH will exhibit technology from nearly all product divisions in Hall 7, Booth 139 at the upcoming SMT/Hybrid/Packaging, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany. SEHO is the only manufacturer worldwide who offers customers systems for all fields of automated soldering, integrated solutions for optical solder joint inspection, intelligent concepts for board handling and material management, as well as efficient and ergonomic work places, engineering, and informational seminars.
At this year’s SMT/Hybrid/Packaging, SEHO will focus on processes for THT assemblies. With the aim to improve both product quality and system availability, fluxing in wave soldering applications is raised to a new level: In a plasma process flux powder is selectively deposited at the solder joints. The results are convincing- remarkably reduced flux residues on the assembly, lower flux consumption, true VOC-free process, and improved solderability of overaged surfaces.
Another highlight in view of wave processes is the nitrogen wave soldering system PowerWave N2. The system is designed for medium to large-sized production volumes. While featuring low operating costs, PowerWave N2 offers high profitability and maximum flexibility.
In the field of selective soldering SEHO also meets highest requirements in terms of flexibility both with regard to production volume and processes. In its basic version, SelectLine-C is designed for stand-alone operation, however, it can be extended any time with additional fluxer, preheat and soldering modules due to its consistently modular concept. Moreover, a brush module and AOI module can directly be integrated thus ensuring clear cost benefits. Technological highlight of the SelectLine-C is the Synchro concept, an intelligent software feature that nearly doubles production volume without major investments.
Also very flexible, particularly in view of the soldering process, is the SEHO LeanSelect, a selective soldering system that is designed for lean production manufacturing environments. The system offers highest productivity on a small footprint of only 2.5 m², and features flexible miniwave soldering or dip soldering with short cycle times.
As all of SEHO’s selective soldering systems, the machine incorporates numerous functions for automatic process control and may be equipped with SEHO’s automated ultrasonic nozzle cleaning system that guarantees reproducible processes.
Target of the product division Automation Technology is to improve the design of working processes in electronics manufacturing. Customer-specific solutions with passing out and turn stations; paternoster or buffer systems are only a few examples. In the center of the attention are creative work places with ergonomically adjustable swiveling tables that are individually adjustable in height to offer an optimum environment for each operator. All connected transport and handling units adapt automatically.
For the SMT production SEHO is introducing a new process gas cleaning system for the reflow soldering system MaxiReflow. As an alternative to the well-established cyclone technology, the MaxiReflow now also can be equipped with a module that thermally decomposes residues from PCB material or solder pastes.
Depending on the materials used in SMT production, customers now have the choice for the optimum process gas cleaning concept to reduce maintenance to an absolute minimum.
For further information, please visit SEHO at SMT/Hybrid/Packaging in Booth 7-139 or online at www.seho.de.