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Akrometrix Announces Enhanced Digital Image Correlation (DIC) Module

Mar 30, 2016

Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics packaging industries, today introduced the latest generation Digital Image Correlation (DIC) module for both its AXP and PS200 platforms.

DIC is the industry standard for strain (CTE) measurements and Akrometrix’s unique dual camera approach provides unparalleled x-y strain metrology throughout a thermal profile from room temperature up to 300oC. With a resolution approaching 100 microstrains, the DIC solution is an optional module to Akrometrix’s AXP and PS200 shadow moiré systems.

The AXP and PS200S warpage and strain measurement systems, using both shadow moiré and digital image correlation (DIC), allow customers complete flexibility for both warpage and strain metrology on the same platform. “This modular approach substantially increases the capabilities of our systems while increasing the ROI on investments,” noted Neil Hubble, Akrometrix’s Director of Engineering.

For more information about Akrometrix’s warpage and strain metrology systems, please contact sales.akrometrix.com or visit www.akrometrix.com.


Akrometrix is the leader in thermal warpage and strain metrology for the front-end/back-end wafer, back-end packaging/assembly, panel and the PCB/component markets. The company provides both capital equipment and test services to measure warpage and strain in temperatures from -50°C to 300°C on virtually any substrate up to 600mm x 600mm, regardless of shape. Located in Atlanta, Georgia, Akrometrix has been serving customers worldwide for more than 20 years based on technology developed at Georgia Tech. For more information, contact Akrometrix at Sales@Akrometrix.com or visit www.Akrometrix.com.

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