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CyberOptics Will Demonstrate How Its 3D AOI Maximizes ROI and Line Utilization at NEPCON China

Mar 27, 2016

3D AOI Maximizes ROI.

3D AOI Maximizes ROI.

CyberOptics® Corporation (NASDAQ: CYBE) today announced that it will exhibit in Booth # 1E48 with Kasion Automation Ltd. (KAL) at NEPCON China, scheduled to take place April 26-28, 2016 at the Shanghai World EXPO Exhibition & Convention Center.

CyberOptics’ will demonstrate the new SQ3000™ 3D Automated Optical Inspection (AOI) system that is increasingly being adopted by customers as a best-in-class solution.

The SQ3000™ 3D AOI system maximizes ROI and line utilization with multi-view 3D sensors that capture and transmit data simultaneously, and in parallel, accelerating 3D inspection speed versus alternate technology. The proprietary Multi-Reflection Suppression (MRS) technology combined with the highly sophisticated 3D fusing algorithms offers microscopic image quality at production speeds. An easy-to-use, intuitive interface with touch control facilitates minimal training and operator interaction.

For more information, visit www.cyberoptics.com.


CyberOptics Corporation (www.cyberoptics.com) is a leading global developer and manufacturer of high precision sensing technology solutions. CyberOptics’ sensors are used in general purpose metrology and 3D scanning, surface mount technology (SMT) and semiconductor markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of key vertical segments. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.

Statements regarding the Company’s anticipated performance are forward-looking and therefore involve risks and uncertainties, including but not limited to: market conditions in the global SMT and semiconductor capital equipment industries; increasing price competition and price pressure on our product sales, particularly our SMT systems; the level of orders from our OEM customers; the availability of parts required to meet customer orders; unanticipated product development challenges; the effect of world events on our sales, the majority of which are from foreign customers; rapid changes in technology in the electronics markets; product introductions and pricing by our competitors; the success of our 3D technology initiatives and other factors set forth in the Company’s filings with the Securities and Exchange Commission.

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