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Indium Corporation’s New Indium10.8HF Solder Paste Technology Exhibits Best-in-Class Non-Wet Open Performance

Mar 22, 2016

Indium Corporation's new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic packages, such as microprocessors.   

In addition to its resistance to non-wet opens, Indium10.8HF also delivers a superior oxidation barrier, allowing for reduced head-in-pillow (HiP) defects and improved graping performance. It also exhibits exceptional stencil printing, especially for small components (01005) and fast printing speeds (>125 mm/sec).

Indium10.8HF solder paste is part of Indium Corporation’s family of high-performance, lead-free, low-voiding, no-clean solder pastes that help manufacturers Avoid the Void™. For more information about Indium10.8HF, email askus@indium.com or visit www.indium.com/indium10.8HF.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

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