SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Indium Corporation


Indium Corporation VP of Technology to Present at SMT Hybrid Packaging

Mar 17, 2016

Dr. Ning-Cheng Lee, Vice President of Technology at Indium Corporation.

Dr. Ning-Cheng Lee, Vice President of Technology at Indium Corporation.

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will present a two-part workshop at SMT Hybrid Packaging 2016, on April 26-28 in Nuremberg, Germany.

Dr. Lee’s workshop, DfX for Advanced Soldering Technology, covers the principles of designing for manufacturability (DfM) and reliability (DfR). Participants will learn how to maximize the output of manufacturing yield and reliability when addressing advanced soldering technology. Dr. Lee’s lessons will include real-world case studies, with fundamental consideration and mechanisms of challenges well illustrated.

Dr. Lee is a world-renowned soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with an emphasis on both high-performance and low cost of ownership.

SMT Hybrid Packaging is Europe’s leading event on system integration in microelectronics. The event offers a wide, international spectrum of exhibitors with the latest information on upcoming trends and developments.

Indium Corporation can also be found on the show floor at stand 7-331.


Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

You must be a registered user to talk back to us.

More News from Indium Corporation

Aug 30, 2016 -

Indium Corporation Experts to Present at IEMT–EMAP 2016

Aug 09, 2016 -

Indium Corporation Receives ON Semiconductor Award for “Perfect Quality” in 2015

Aug 03, 2016 -

Indium Corporation’s State-of-the-Art Recycling Process Delivers Credit for Solder Pot Dross and Contaminated Solder

Apr 26, 2016 -

Indium Corporation VP of Technology to Host Webtorials May 17 & 19

Apr 22, 2016 -

Indium Corporation Announces Karch as Regional Technical Manager for Germany, Austria and Switzerland

Apr 21, 2016 -

Indium Corporation Expert Presents at SMTA ICSR 2016

Apr 12, 2016 -

Indium Corporation's New Indium10.2HF Solder Paste Delivers Superior ICT Performance

Apr 07, 2016 -

Indium Corporation’s Lasky to Present at Joint SMTA and IMAPS Meeting

Apr 06, 2016 -

Indium Corporation's Indium8.9HF Solder Paste Series Technology Solution to Avoid the Void™

Mar 29, 2016 -

Indium Corporation Names Hults as Global Accounts Manager

(241) more news from Indium Corporation

Indium Corporation VP of Technology to Present at SMT Hybrid Packaging news release has been viewed 246 times

SMT in-printer dispensing

PCB Soldering Tools