Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it was awarded two 2016 NPI Awards during a Tuesday, March 15, 2016 ceremony that took place at the Las Vegas Convention Center during the IPC APEX EXPO. Seika won for the following categories: Cleaning equipment for the Unitech UC-250M-CV Board Cleaner and Process Control Tools for the Malcomtech RCX Series Modular Reflow Oven Profiling System.
Michelle Ogihara, Seika’s Senior Sales Manager, commented about the two awards, “With Seika’s merger last year, we were able to acquire these unique and popular process control products that are widely used throughout Japan and Asia. Many of the Malcomtech systems, such as the solder paste mixers and viscometers, have been sold into SMT assemblers here in North America as well. We are pleased that the Malcom RCX modular profiling system and Unitech PCB cleaner have been recognized for their advanced, unique technology by the NPI Awards.”
The UC-250M-CV Board Cleaner offers a dual cleaning feature using a combination of a brush roller with the silicone/adhesive cleaning rollers. The combination dual dust removal system assures better results than a single brush or adhesive roller system. The UC-250M-CV has the ability to clean the top surface of PCB even chip components attached on the bottom-side. Additionally, the cleaner features an antistatic bar (ionizer) to neutralize static and prevent dust from collecting on the top surface of the PCB.
The RCX system offers complete profiling of reflow ovens, including oven temperature, video imaging, O2 concentration and convection air velocity. It verifies that ovens are performing at optimal conditions, and enables users to troubleshoot problem areas. The RCX Series offers 6 and 12 channel reflow oven thermo-profiling and is fully modular, so one memory unit serves as the temperature profiler, as well the base unit for the other add-ons (O2 sensor, velocity sensor and camera).
Premiering in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.
For more information about the rest of the equipment on display or Seika’s complete product line, contact Michelle Ogihara at email@example.com or visit www.seikausa.com.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.