SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Shenmao Technology Inc.

SHENMAO Features Solder Preforms at IPC APEX 2016

Mar 11, 2016

SHENMAO Solder Preforms offer accurate solder deposition for various soldering processes. Reel packaged Solder Preforms provide opportunity for automation and efficient application to supplement solder when insufficient quantity solder paste is provided by design.

Custom Material may be formulated to unique material and dimensional requirements.

SHENMAO recently expediently solved an insufficient solder issue problem experienced by a major Electric Automobile Manufacturer that prevented a costly potential field repair.

As the Worlds Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Laser Soldering Paste, Wave Solder Bar, Solder Wire, Solder Preform, Package on Package Solder Paste, Bumping Solder Paste, Low Temperature Solder Paste, Semiconductor Packaging Solder Spheres, Liquid Flux, Paste Flux and PV Ribbon.

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More News from Shenmao Technology Inc.

Mar 20, 2017 -

SHENMAO America, Inc. Introduces Omega Aleaciones S.A. de C.V. the Exclusive Mexico Distributor of SHENMAO Solder Paste & Flux

Feb 01, 2017 -

SHENMAO America, Inc. Sponsors the SMTA Pan Pacific Microelectronics Symposium, February 6-9, 2017

Jan 30, 2017 -

SHENMAO America, Inc. Exhibits February 14 - 16 at IPC APEX EXPO 2017 Booth # 1532 San Diego Convention Center

Oct 09, 2016 -

SHENMAO Technology presents a Poster at the 13 th. IWLPC At DoubleTree Airport Hotel by Hilton, San Jose, CA, USA

Oct 09, 2016 -

SHENMAO America, Inc. Exhibits October 18-19 at IWLPC Introduces Semiconductor Packaging Materials

Sep 26, 2016 -

SHENMAO Introduces Room Temperature Storable RT Series Solder Paste at SMTAI Booth # 800 September 27-28, 2016

Sep 13, 2016 -

SHENMAO Exhibits at SMTA International at Donald E Stephens Convention Center, Rosemont, Il September 27-28, 2016 Booth # 800

Aug 23, 2016 -

SHENMAO Exhibits at SEMICON TAIWAN on September 7-9, 2016 Booth # J2922 Featuring BGA Solder Spheres and Bumping Paste

Jul 11, 2016 -

SHENMAO Introduces SMF-WB02 / SMF-WB51 Water Soluble Flux At Semicon West 2016 Booth # 6467 in San Francisco

Jul 07, 2016 -

SHENMAO Introduces BGA and Micro BGA Bumping Solder Paste At Semicon West 2016 Booth # 6467 in San Francisco

(18) more news from Shenmao Technology Inc.

SHENMAO Features Solder Preforms at IPC APEX 2016 news release has been viewed 413 times

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