SMT, PCB Electronics Industry News

SHENMAO Features LED Die Bonding Solder Pastes at IPC APEX 2016

Mar 10, 2016

SHENMAO proudly announces a series of Lead-free LED Die Bonding Solder Pastes made locally in the USA and with the same quality in 8 other worldwide locations for various Die Bonding processes. Powder Size is available from T3 to T8.

SHENMAO PF606-P116 offers Long Stencil Printing Life, High Tackiness (slump resistant), and consistent printability with Superior Wetting Characteristics for LED Die Bonding Highly Reliable and Lowest Void (Smaller and Fewer Voids) Solder Joints with Optimum Maximized Quality through Highest Productivity.

SHENMAO PF606-P128 LED Die Bonding Solder Paste, available for dispensing in Syringes in Lower Viscosity, exhibits excellent Slump Characteristics, consistent dispense ability, and stable tackiness.

SHENMAO PF606-XP LED Dipping Solder Paste has great Viscosity Characteristics and stable Tackiness exhibiting extremely uniform Dipping Volume and Transfer Rate for consistent High Quality Solder Joints.

As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux and PV Ribbon.

SHENMAO America, Inc. www.shenmao.com Tel: 408-943-1755 e-mail: usa@shenmao.com
BOOTH # 1721 www.ipcapexexpo.org/

 

Jul 09, 2017 -

SHENMAO Exhibits at SEMICON WEST July 11-13, 2017 Booth # 5716 Introduces New Tacky Flux SMF-WC52 for Flip Chip Technology

Jul 06, 2017 -

SHENMAO Exhibits at SEMICON WEST July 11-13, 2017 Booth # 5716 Introduces New Low Residue Liquid Flux SMF-B51

Jun 25, 2017 -

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

May 03, 2017 -

SHENMAO America, Inc. Exhibits Monday, May 8 Booth # 7

Mar 20, 2017 -

SHENMAO America, Inc. Introduces Omega Aleaciones S.A. de C.V. the Exclusive Mexico Distributor of SHENMAO Solder Paste & Flux

Feb 01, 2017 -

SHENMAO America, Inc. Sponsors the SMTA Pan Pacific Microelectronics Symposium, February 6-9, 2017

Jan 30, 2017 -

SHENMAO America, Inc. Exhibits February 14 - 16 at IPC APEX EXPO 2017 Booth # 1532 San Diego Convention Center

Oct 09, 2016 -

SHENMAO Technology presents a Poster at the 13 th. IWLPC At DoubleTree Airport Hotel by Hilton, San Jose, CA, USA

Oct 09, 2016 -

SHENMAO America, Inc. Exhibits October 18-19 at IWLPC Introduces Semiconductor Packaging Materials

Sep 26, 2016 -

SHENMAO Introduces Room Temperature Storable RT Series Solder Paste at SMTAI Booth # 800 September 27-28, 2016

21 more news from Shenmao Technology Inc. »

Aug 19, 2017 -

See Latest Dispense Technology Demonstrations From GPD Global at NEPCON 2017

Aug 17, 2017 -

ZESTRON Americas Announces New Regional Sales Manager

Aug 17, 2017 -

SEHO Soldering Expert to Discuss Resource & Cost Efficient Wave Soldering at SMTAI

Aug 17, 2017 -

Libra Industries Announces Two 20-Year Service Awards in Q2 2017

Aug 17, 2017 -

Cirtronics Installs High-Performance X-ray Inspection Solution

Aug 17, 2017 -

Essemtec to Show New All-in-One Jetting / Placement System at SMTAI

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 17, 2017 -

What is SMT and where to by SMT spare parts

Aug 16, 2017 -

ViTrox and KIC Establish Cooperation and Connectivity

Aug 16, 2017 -

Inovaxe Is Making Storage SMARTER – Visit Booth #915 at SMTAI

See electronics manufacturing industry news »

SHENMAO Features LED Die Bonding Solder Pastes at IPC APEX 2016 news release has been viewed 540 times

Large PCB Dispensing System

reflow oven profiler