SMT, PCB Electronics Industry News

SHENMAO Features LED Die Bonding Solder Pastes at IPC APEX 2016

Mar 10, 2016

SHENMAO proudly announces a series of Lead-free LED Die Bonding Solder Pastes made locally in the USA and with the same quality in 8 other worldwide locations for various Die Bonding processes. Powder Size is available from T3 to T8.

SHENMAO PF606-P116 offers Long Stencil Printing Life, High Tackiness (slump resistant), and consistent printability with Superior Wetting Characteristics for LED Die Bonding Highly Reliable and Lowest Void (Smaller and Fewer Voids) Solder Joints with Optimum Maximized Quality through Highest Productivity.

SHENMAO PF606-P128 LED Die Bonding Solder Paste, available for dispensing in Syringes in Lower Viscosity, exhibits excellent Slump Characteristics, consistent dispense ability, and stable tackiness.

SHENMAO PF606-XP LED Dipping Solder Paste has great Viscosity Characteristics and stable Tackiness exhibiting extremely uniform Dipping Volume and Transfer Rate for consistent High Quality Solder Joints.

As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux and PV Ribbon.

SHENMAO America, Inc. www.shenmao.com Tel: 408-943-1755 e-mail: usa@shenmao.com
BOOTH # 1721 www.ipcapexexpo.org/

 

Jun 25, 2017 -

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

May 03, 2017 -

SHENMAO America, Inc. Exhibits Monday, May 8 Booth # 7

Mar 20, 2017 -

SHENMAO America, Inc. Introduces Omega Aleaciones S.A. de C.V. the Exclusive Mexico Distributor of SHENMAO Solder Paste & Flux

Feb 01, 2017 -

SHENMAO America, Inc. Sponsors the SMTA Pan Pacific Microelectronics Symposium, February 6-9, 2017

Jan 30, 2017 -

SHENMAO America, Inc. Exhibits February 14 - 16 at IPC APEX EXPO 2017 Booth # 1532 San Diego Convention Center

Oct 09, 2016 -

SHENMAO Technology presents a Poster at the 13 th. IWLPC At DoubleTree Airport Hotel by Hilton, San Jose, CA, USA

Oct 09, 2016 -

SHENMAO America, Inc. Exhibits October 18-19 at IWLPC Introduces Semiconductor Packaging Materials

Sep 26, 2016 -

SHENMAO Introduces Room Temperature Storable RT Series Solder Paste at SMTAI Booth # 800 September 27-28, 2016

Sep 13, 2016 -

SHENMAO Exhibits at SMTA International at Donald E Stephens Convention Center, Rosemont, Il September 27-28, 2016 Booth # 800

Aug 23, 2016 -

SHENMAO Exhibits at SEMICON TAIWAN on September 7-9, 2016 Booth # J2922 Featuring BGA Solder Spheres and Bumping Paste

19 more news from Shenmao Technology Inc. »

Jun 26, 2017 -

Altus get SMART with Koh Young’s Innovative New Software

Jun 26, 2017 -

Ersa to Hold Versaflow 3 Level II Maintenance Training Course

Jun 25, 2017 -

Libra Industries’ Christopher R. Howell Memorial Foundation Awards $20,000 in Scholarships during Annual Golf Outing

Jun 25, 2017 -

Ersa Brings the ‘Little Big One’ to SMTA Ohio – Award-Winning Selective Solder

Jun 25, 2017 -

Optimal Electronics Releases Process Control and Traceability Solution for Nordson ASYMTEK Applications in Clean Rooms for Sensor Assembly

Jun 25, 2017 -

Inovaxe Partners with Repstronics in Mexico

Jun 22, 2017 -

PNC Inc. Invests in LED Laser Direct Imaging system from Miva Technologies

Jun 22, 2017 -

Addressing The Modulation of Light Output -- High Quality LED Manufacturing

Jun 22, 2017 -

Schleuniger, Inc. Receives 2017 Best of Manchester Award

Jun 21, 2017 -

Inovar Inc. Breaks Ground for New Facility on USU Innovation Campus

See electronics manufacturing industry news »

SHENMAO Features LED Die Bonding Solder Pastes at IPC APEX 2016 news release has been viewed 460 times

TWEEZER-VAC ELITE Vacuum SMD Tweezer Kit

Reflow Ovens thermal process improvement