SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • IPC Joins NextFlex Standards development key focus of IPC involvement in flexible hybrid manufacturing institute

IPC Joins NextFlex Standards development key focus of IPC involvement in flexible hybrid manufacturing institute

Feb 25, 2016

IPC — Association Connecting Electronics Industries® has become a partner of NextFlex, America’s flexible hybrid electronics manufacturing institute, which is based in Mountain View, Calif. As part of the National Network for Manufacturing Innovation (NNMI), this new public-private partnership aims to establish America as the global leader in the flexible hybrid electronics manufacturing space.

Among other things, as a NextFlex partner, IPC will apply its strength and expertise in standards development to assist the institute in creating roadmaps for industry standards for flexible hybrid electronics manufacturing. Since 2012, IPC has published five standards on printed electronics materials, processes, terms and definitions, and design. The IPC Printed Electronics Committee is also working on six additional standards. As a member of the institute, IPC and NextFlex will explore ways to collaborate on printed electronics standards and test methods. Collaborative efforts will provide the printed electronics community with the standards and education needed to advance this technology, shorten product lead times, and improve and enhance product performance.

“IPC looks forward to being a part of NextFlex to advance innovation in flexible hybrid electronics manufacturing,” said Ken Schramko, IPC director of government relations. “IPC has been a strong supporter of the NNMI, which was launched by the Administration to drive American competitiveness in advanced manufacturing. IPC played a lead role in promoting the Revitalize American Manufacturing Innovation (RAMI) Act of 2014. This legislation authorized the NNMI and was signed into law by President Obama in December 2014.” For more information on NextFlex or the NNMI, contact Ken Schramko, at KenSchramko@ipc.org.


IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
 

Dec 04, 2017 -

IPC Optimistic After U.S. Senate Passes Tax Reform Bill

Dec 04, 2017 -

North American PCB Sales Growth Turns Positive

Nov 30, 2017 -

IPC APEX EXPO 2018 Attendees Can Succeed at the Velocity of Technology at Free Networking Events

Nov 29, 2017 -

IPC Crowns New Hand Soldering Competition World Champion

Nov 13, 2017 -

New Software Toolkit, CFX Messaging Library Expedites Connected Factory Exchange Implementation

Nov 13, 2017 -

Ventec International Group Receives IPC-4101 Qualified Products Listing Certification

Nov 07, 2017 -

IPC Releases G Revisions of Two Widely Used Standards, IPC-A-610 and IPC J-STD-001

Oct 30, 2017 -

IPC Pulse Survey Reveals Bullish Outlook for Equipment and PCB Manufacturers

Oct 26, 2017 -

IPC Hand Soldering Competition Winner Crowned at ELECTROSUB 2017 in Budapest

Oct 18, 2017 -

IPC Hand Soldering Competition Winner Crowned at IFTEC in Paris

867 more news from Association Connecting Electronics Industries (IPC) »

Dec 15, 2017 -

Sono-Tek Appoints Applications Engineer for Electronics & Advanced Energy Division

Dec 14, 2017 -

Ersa to Hold Versaflow 3 Maintenance Training Course in Mexico

Dec 12, 2017 -

ECT’s Switch Probes: Cost-Efficient Solutions for Testing Electronic Assemblies

Dec 12, 2017 -

NEO Tech Design Team Wins Industry Award for Creative Solutions that Accelerate Time-to-Market

Dec 12, 2017 -

STI Has Accomplished AS9100D Certification

Dec 07, 2017 -

Nordson ASYMTEK Receives 2017 Global Technology Award for the NexJet NJ-8 Jetting System with ReadiSet 2-piece Jet Cartridge Award presented at Productronica 2017

Dec 07, 2017 -

Banner Engineering Completes Implementation of Optel Software on ASM Lines in Minneapolis and Suzhou (China)

Dec 06, 2017 -

Pan Pacific Microelectronics Symposium Program Finalized

Dec 05, 2017 -

Scienscope Promotes Don Jeka to National Sales & Marketing Manager for Its X-ray Division

Dec 05, 2017 -

Super Thin Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

See electronics manufacturing industry news »

IPC Joins NextFlex Standards development key focus of IPC involvement in flexible hybrid manufacturing institute news release has been viewed 595 times

  • SMTnet
  • »
  • Industry News
  • »
  • IPC Joins NextFlex Standards development key focus of IPC involvement in flexible hybrid manufacturing institute
SMT in-printer dispensing

Selective Conformal Coating System - GPD SimpleCoat