SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from ZESTRON Corporation


“Thermal Profile Variation and PCB Reliability” by Jigar Patel, Senior Application Engineer, ZESTRON, to be presented at APEX 2016

Feb 24, 2016

ZESTRON, the global leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that Jigar Patel, M.S.Ch.E., Senior Application Engineer, ZESTRON, will present “Thermal Profile Variation and PCB Reliability” during the Flux Reliability II session on Thursday, March 17th, at APEX 2016.

When designing PCBs, the manufacturing process is developed and refined. Critical to the quality of the solder joint is an effective thermal cycle. As PCB surface density and component mass increases, is the recommended thermal profile sufficient to produce quality solder bonds and fully volatilize flux residues? Flux residues remaining on a PCB surface and/or component may lead to failure mechanisms including leakage current, electrochemical migration and dendritic growth. Recognizing that reflow optimization is increasingly challenging as component density and thermal mass variation increases on the electronic assembly, surface temperature variation on the PCB is inevitable.

This study was conducted to assess the effect of thermal profile variations on flux residue formation. It was limited to No-Clean solder pastes as this paste may or may not be cleaned. Cleanliness assessment results from ionic contamination and SIR analysis will also be reviewed.

For more information about ZESTRON’s process solutions and services, please visit booth #2624.  Our team stands ready to provide comprehensive solutions to your cleaning needs.


Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With seven worldwide technical centers and the largest team of chemical engineers in the industry, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal. For additional information and to tour one of our unparalleled technical centers, please visit www.zestron.com.

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“Thermal Profile Variation and PCB Reliability” by Jigar Patel, Senior Application Engineer, ZESTRON, to be presented at APEX 2016 news release has been viewed 351 times

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