Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will exhibit in Booth #1145 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. The Seika team will be available to demonstrate industry-leading equipment from Sayaka, Hioki, SAWA, McDry, Eightech, Unitech, Andes, MALCOM and DENON INSTRUMENTS.
The RD-500V Rework Station features a two mega pixel full HD camera with a 19" LCD display for easy visual alignment. It samples the data in very small intervals of 0.1 sec, allowing extremely accurate temperature control. The RD-500V is equipped with powerful built-in 1000W heaters on both the top- and bottom-side, and an area heater that includes six quick heating 600W IR heaters. Precise profiling including detailed temperature curves can be executed with the ability to closely control up to 30 zones.
The UC-250M-CV Board Cleaner adds a dual cleaning feature using a combination of a brush roller with the silicone/adhesive cleaning rollers. The combination dual dust removal system assures better results than a single brush or adhesive roller system. The UC-250M-CV has the ability to clean the top surface of PCB even chip components attached on the bottom side. Additionally, the cleaner features an antistatic bar (ionizer) to neutralize static and prevent dust from collecting on the top surface of the PCB.
The SAYAKA SAM-CT35Q Large Board Model is a tabletop, automatic precision PCB router. The compact size and weight of the system makes it ideal for limited work spaces and versatility in a production line setup. The easy-to-use system features a push button control to start operation.
The MALCOM PCU-200 Digital Viscometer features a patented spiral-pump sensor that provides quick, easy and repeatable measurements. It provides continuous measurement of newtonian and non-newtonian fluids with constant shear rate and shear time. Additionally, the system features automatic control of measurement according to JIS standards (PCU-203,205). Application includes solder pastes, thick film pastes, solder resists, liquid resists, inks, etc.
For more information about the rest of the equipment on display or Seika’s complete product line, contact Michelle Ogihara at firstname.lastname@example.org or visit www.seikausa.com.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.