SMT, PCB Electronics Industry News

SEHO to Make Selective Soldering Smarter at APEX

Feb 16, 2016

SEHO North America, Inc., a worldwide leading supplier of complete solutions for soldering processes and automated production lines, will highlight the SelectLine-C and GoSelective-LS selective soldering machine in Booth #1850 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. SEHO continues to release new technologies to ensure higher productivity in electronic productions with flexible and innovative machines.

The SelectLine-C machine concept is consistently modular, thus ensuring clear cost benefits. The fluxer module, various preheat modules and soldering modules may be equipped individually, and depending on the requirements, they can be configured into a complete manufacturing line.

The soldering area of the SelectLine-C scores highly thanks to its outstanding precision and flexibility. Two electro-magnetic soldering units for mini-wave or dip processes may be integrated. Especially two new and unique features that are patented by SEHO ensure a remarkable increase in productivity: The automatic ultrasonic nozzle cleaning function guarantees reliable processes and maximum machine availability, and the Synchro software feature nearly doubles production volume without major investments.

With the new GoSelective-LS, SEHO has introduced an innovative system that represents the smart entry into selective soldering. Featuring an outstanding ROI, the GoSelective-LS efficiently replaces manual soldering processes.

The GoSelective-LS is particularly designed for stand-alone production of small and medium sized volumes and it scores highly with its very compact design. To ensure an ergonomical work flow and the shortest cycle times, the GoSelective-LS is equipped with a loading and unloading station for carriers up to 20” x 20” that is mounted in front of the machine. This station incorporates a manually moved cross transfer that allows users to comfortably slide the carriers from left to right and vice versa. Therefore, it is possible to assemble boards in one carrier while a second carrier is being processed in the machine.

While loading and unloading of the system is performed manually, all process steps are completely automated. The machine features a precise axis system that reliably positions the drop jet fluxer, preheat unit and soldering unit during the process.

Depending on the requirements, the electro-magnetic soldering unit may be used for flexible mini-wave soldering processes, or can be equipped with a multi-nozzle tool for dip soldering with short cycle times.

Of course, all selective soldering systems from SEHO feature a comprehensive hardware and software package to ensure 100 % automatic process control.

In addition to the innovative soldering equipment, SEHO also will feature advanced solders and fluxes from Stannol. For more than 130 years, Stannol has been a reliable partner to the electronics industry when it comes to innovative soldering materials.

For further information, please visit SEHO at APEX in Booth #1850 or online at www.sehona.com.

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