SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from MET Stencil


MET Stencil Launches NanoSlic® Gold coated Stencil

Feb 10, 2016

MET Stencil Launches NanoSlic® Gold Coated Stencil

MET Stencil Launches NanoSlic® Gold Coated Stencil

Feb 08, 2016

MET Stencil announces the launch of the NanoSlic® Gold stencil. NanoSlic® is the world's most advanced stencil coating technology for improving solder paste printing.
"We are pleased to announce that we have been licensed by FCT Assembly to sell this coating to the US market.” said Fred Cox, President of MET Stencil. "Stencil users will immediately see the benefits in their print."

 
The new NanoSlic® Gold stencil is the next generation of stencil technology developed to address the increasing demands confronting the electronic assembly industry. The NanoSlic® Gold coating is based on a proprietary application process that coats both the underside of the stencil, and the aperture walls. This robust coating is hydrophobic, oleophobic, and “fluxophobic”. It improves solder paste release. NanoSlic® Gold is thermally cured and is a permanent coating. The NanoSlic® technology significantly improves solder paste transfer efficiencies for small apertures resulting in higher yields and less rework. In addition, NanoSlic® minimizes bridging and reduces underside cleaning. This technology can be easily evaluated and is compatible with current assembly equipment and processes.

NanoSlic® Gold coated stencils are now available and manufactured by MET Stencil.

www.metstencil.com. 

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