SMT, PCB Electronics Industry News

NEW BOOK ANNOUNCEMENT: Process Simulation Using WITNESS

Feb 10, 2016

- Emphasizes real-world applications of simulation modeling in both services and manufacturing sectors
- Discusses the role of simulation in Six Sigma projects and Lean Systems
- Contains examples in each chapter on the methods and concepts presented
PMC is pleased to announce the publication of a newly released book, Process Simulation Using WITNESS (John Wiley & Sons, Inc, 2015), now available for sale in both print and e-book formats.  This book, written by Simulation Specialists from PMC, teaches basic and advanced modeling and simulation techniques to both undergraduate and postgraduate students. Process Simulation Using WITNESS serves as a practical guide and manual for professionals, researchers, engineers, management consultants, and simulation trainers for building simulation models using WITNESS, a free-standing software package. Read an excerpt and learn more at this link:http://www.wiley.com/WileyCDA/WileyTitle/productCd-0470371692,subjectCd-BA32.html

Feb 10, 2016 -

Laser Scanning Workshop

Feb 10, 2016 -

PMC Offers High-Tech Gift to the WA3

Jun 28, 2017 -

Vapor Phase Manufacturer IBL Technologies Holds 30 Year Anniversary Event

Jun 28, 2017 -

COT Completes $2 Million Expansion of Its Gainesville, Georgia Manufacturing Headquarters

Jun 28, 2017 -

Ersa Versaflow Level II Application Training Course

Jun 28, 2017 -

SMTA Releases Wave Soldering Online Course

Jun 27, 2017 -

Flying Probe, Functional Test & Inline Test – Visit Acculogic at SMTA Ohio Expo

Jun 27, 2017 -

VJ Technologies and Datest Partner in West Coast Inspection Services, Showroom and Demonstration Center.

Jun 26, 2017 -

Altus get SMART with Koh Young’s Innovative New Software

Jun 26, 2017 -

Ersa to Hold Versaflow 3 Level II Maintenance Training Course

Jun 25, 2017 -

Libra Industries’ Christopher R. Howell Memorial Foundation Awards $20,000 in Scholarships during Annual Golf Outing

Jun 25, 2017 -

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

See electronics manufacturing industry news »

NEW BOOK ANNOUNCEMENT: Process Simulation Using WITNESS news release has been viewed 272 times

 Reflow System

3D SPI